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Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device and atomic clock

A piezoelectric vibrator and a manufacturing method technology, which are applied to power oscillators, electric solid-state devices, instruments, etc., can solve problems such as uneven size of fixtures, rising manufacturing costs, and large working hours.

Inactive Publication Date: 2011-01-05
SII CRYSTAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that not only takes a huge amount of work man-hours, but also increases the manufacturing cost.
In addition, the size of the jig that accommodates the piezoelectric vibrator is not uniform due to the influence of dimensional tolerances
Therefore, the processing accuracy at the time of frequency adjustment is affected, and components of the piezoelectric vibrator that should not be processed may be processed by mistake.
Therefore, there is a concern that the quality of the piezoelectric vibrator may deteriorate

Method used

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  • Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device and atomic clock
  • Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device and atomic clock
  • Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device and atomic clock

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0112] Below, refer to Figure 1 to Figure 22 , the first embodiment of the manufacturing method of the piezoelectric vibrator of the present invention and the piezoelectric vibrator manufactured by the manufacturing method will be described.

[0113] The piezoelectric vibrator 1 manufactured by the manufacturing method of this embodiment, such as Figure 1 to Figure 5 As shown, a piezoelectric vibrating reed 4 having a pair of mounting electrodes 46 and 47 electrically connected to a pair of excitation electrodes 45 is sealed in a cavity C formed between a base substrate 2 and a lid substrate 3 that are anodically bonded to each other. surface mount type (2-layer structure type) piezoelectric vibrator 1.

[0114] This piezoelectric vibrator 1 includes: a pair of mounting patterns 21, a base substrate 2 formed in a cavity C, electrically connected to a pair of mounting electrodes 46, 47, respectively, and supporting a piezoelectric vibrating piece 4; a bonding electrode film 32...

no. 2 approach

[0166] Next, refer to Figure 23 to Figure 26 , the second embodiment of the manufacturing method of the piezoelectric vibrator of the present invention and the piezoelectric vibrator manufactured by the manufacturing method will be described. In addition, in this 2nd embodiment, the same code|symbol is used for the same part as 1st embodiment, and the description is abbreviate|omitted, and only a different point is demonstrated.

[0167] like Figure 23 As shown in the flow chart of , in the manufacturing method of the piezoelectric vibrator of this embodiment, the external electrode forming step ( S53 ) is performed before the gettering step ( S51 ). In addition, when the gettering step ( S51 ) is performed, the series resonance resistance values ​​of the plurality of piezoelectric vibrating reeds 4 sealed in the cavity C are measured simultaneously. In addition, the piezoelectric vibrator manufactured by the manufacturing method of this embodiment is the same as the piezo...

no. 3 approach

[0197] Next, refer to Figure 27 , the third embodiment of the manufacturing method of the piezoelectric vibrator and the piezoelectric vibrator manufactured by the manufacturing method of the present invention will be described. In addition, in this third embodiment, the same reference numerals are assigned to the same components as those in the second embodiment, and description thereof will be omitted, and only differences will be described.

[0198] like Figure 27 As shown in the flow chart of , in the manufacturing method of the piezoelectric vibrator of this embodiment, the trimming step ( S54 ) is performed after the bonding step ( S43 ) and before the cutting step ( S52 ). In addition, the air intake step (S51) is performed prior to the fine adjustment step (S54). In addition, the piezoelectric vibrator manufactured by the manufacturing method of this embodiment is the same as the piezoelectric vibrator 1 of the above-mentioned second embodiment.

[0199] Hereinaft...

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PUM

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Abstract

A piezoelectric vibrator manufacturing method is provided with a cavity forming step of forming a recessed section for a cavity on at least one of two wafers; a bonding electrode film forming step of forming a bonding electrode film on bonding surfaces of the both wafers; a mount pattern forming step of forming a pair of mount patterns in the cavity; a through hole forming step of forming a pair of through holes in the cavity; a penetrating electrode forming step of forming, in the cavity, a pair of penetrating electrodes electrically connected with the patterns; a mounting step of electrically connecting the patterns and a piezoelectric vibration piece with each other; an overlapping step of storing a getter material by overlapping the both wafers with each other; a bonding step of manufacturing a wafer body by anodically bonding the both wafers; a gettering step of adjusting vacuum degree in the cavity, while measuring a series resonant resistance value; and a cutting step of cutting the wafer body into individual pieces.

Description

technical field [0001] The present invention relates to a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrator is sealed in a cavity formed between two substrates to be bonded, and a piezoelectric vibrator manufactured by the manufacturing method. A piezoelectric vibrator, an oscillator including the piezoelectric vibrator, electronic equipment, and a radio-controlled clock. [0002] This application is based on Japanese Patent Application No. 2007-313513 and Japanese Patent Application No. 2008-017932, and uses the contents thereof. Background technique [0003] In recent years, piezoelectric vibrators using crystals or the like as a time source, a timing source of a control signal, a reference signal source, and the like have been used in mobile phones and portable information terminal devices. Various types of such piezoelectric vibrators have been provided, and as one of them, a surface mount type (SMD: Surface Mount Device) piezoelectric v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H01L23/02H03B5/32H03H3/04H03H9/02H01L41/22H01L41/23H01L41/253H01L41/311H01L41/313H01L41/338
CPCH03H9/21G04F5/063H03H9/1021Y10T29/49126Y10T29/49155Y10T29/49004Y10T29/42Y10T29/49798
Inventor 大内启一星雄起
Owner SII CRYSTAL TECH