Mold protector of special pressing machine for plastic packaging

A technology of plastic encapsulation and protection device, applied in the field of special press for plastic encapsulation, can solve problems such as easy damage of the press, and achieve the effects of improving service life, convenient use and rapid detection

Inactive Publication Date: 2011-01-12
TONGLING TRINITY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the existing special press for plastic

Method used

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  • Mold protector of special pressing machine for plastic packaging
  • Mold protector of special pressing machine for plastic packaging
  • Mold protector of special pressing machine for plastic packaging

Examples

Experimental program
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Effect test

Example Embodiment

[0009] The mold protection device of the plastic packaging special press of the present invention, such as figure 1 As shown, it is fixedly connected to the connection base 2 on the lower platen 3 of the plastic packaging special press 1. The connection base is provided with an inductive probe, which transmits a signal to the control system to control the rise or fall of the punch.

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Abstract

The invention discloses a mold protector of a special pressing machine for plastic packaging, which solves the problem that the existing pressing machine can be damaged easily due to impurities. A connecting seat (2) is fixedly connected with a lower bedplate (3) of a special pressing machine (1) for plastic packaging, the connecting seat is provided with an inductive probe, and the inductive probe transmits signals to a control system to control a male mold to rise or fall. The invention effectively solves the problem that the pressing machine is damaged due to foreign matter.

Description

technical field [0001] The invention relates to a special press for plastic packaging, in particular to a special press for plastic packaging with a mold protection device. Background technique [0002] The special press for plastic packaging (hereinafter referred to as "press") is the core precision component of the circuit packaging system. A punch and a die are respectively installed between the upper and lower plates of the press. The lead frame is placed in the die, and the die Under the action of the driving device, it rises along the guide post to close the mold with the punch and inject the package. Since the mold is a precision machine, the cavity size tolerance is strict, up to 0.01mm level; the finish requirement is relatively high. During use, due to the fact that the lead frame is placed in the die and the hardness of the molding compound is high after curing, the cured molding compound often rubs against the cavity of the mold and damages the mold. At the sam...

Claims

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Application Information

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IPC IPC(8): B29C43/32
Inventor 左根明任运全蔡传辉
Owner TONGLING TRINITY TECH
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