Heat dispersion control method for vehicle electronic control unit

Abstract

The invention discloses a heat dispersion control method for a vehicle electronic control unit, which aims to overcome the problem that a chip is burnt because the thermal stability of the vehicle electronic control unit cannot be guaranteed. The heat dispersion control method comprises the following steps of: firstly, determining high power components with rated power not less than 50 mW in the vehicle electronic control unit, thermal resistances thereof and an allowable maximum operating temperature thereof; secondly, carrying out simulation analysis on current variation of the component and measuring the current of a main drive module for driving two ends of a load; thirdly, calculating the power consumption and the average power consumption of each component; fourthly, determining heat dispersion modes, such as laminated structure, material, wiring, copper bearing rate, thermal via hole and the like of a PCB (Printed Circuit Board) board in the vehicle electronic control unit and determining environmental conditions when the vehicle electronic control unit works; fifthly, establishing a thermal simulation model of the vehicle electronic control unit, solving and calculating the maximum operating temperature of the vehicle electronic control unit and the whole temperature distribution condition; and sixthly, designing the heat dispersion mode of the vehicle electronic control unit according to the calculated result of the thermal simulation model and verifying through tests.

Description

technical field [0001] The invention relates to the design field of electronic control units (ECUs) for vehicles, and more specifically, the invention relates to a method for controlling heat dissipation of electronic control units for vehicles. Background technique [0002] The main failure mode of electronic components is thermal failure. As the temperature increases, the failure rate increases exponentially. In the electronics industry, when the ambient temperature of a device increases by 10°C, its failure rate often increases by an order of magnitude, which is the so-called "10°C rule". According to relevant literature, 55% of the failure rate of electronic equipment is caused by the temperature exceeding the specified value. Therefore, for electronic equipment, even if it is reduced by 1°C, the failure rate of the equipment will be reduced by a considerable amount. This is especially important for electronic systems with high reliability requirements. For example, e...

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the problem that the thermal stability of the electronic control unit for the vehicle cannot be guaranteed and the chip of t

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