Method for processing small-size quartz crystal substrate for manufacturing resonator

Abstract

The invention discloses a method for processing a small-size quartz crystal substrate for manufacturing a resonator. The method has the advantages that: because a relation between vibration frequency omega and size of the quartz crystal substrate is set by the method, the relationship between the vibration frequency and the size of the crystal substrate can be obtained through the relation, the size of the small-size quartz crystal substrate can be determined according to the pre-designed frequency, and the size and the vibration frequency of a large-size quartz crystal substrate to be processed can be further determined so that the vibration frequency of the small-size quartz crystal substrate obtained by cutting meets the designed frequency requirement and the finally obtained small-size quartz crystal substrate is ensured to be a qualified wafer; and the method improves the processing efficiency, and reduces the processing difficulty of the small-size quartz crystal substrate at the same time.

Description

technical field [0001] The invention relates to a shear type quartz crystal resonator, in particular to a processing method for manufacturing a small-sized quartz crystal substrate for the resonator. Background technique [0002] In the design and manufacture of quartz crystal resonators, the vibration frequency of the resonator is the most important performance parameter. Generally, the vibration frequency of the shear type resonator is related to the thickness and size of the quartz crystal substrate, and the size of the quartz crystal substrate (Length, width and thickness) increase will reduce the vibration frequency of the resonator. [0003] The processing of traditional quartz crystal resonators is generally completed on a wafer, and our estimation of the frequency of the wafer is mainly used for the design and processing of resonators. In the calculation of the vibration frequency of the quartz crystal substrate, since the length is usually much greater than the wid...

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Problems solved by technology

However, since the frequency parameters of the large wafers are different from those of the final small wafers, according to the current method, we cannot guarantee an accurate estimation of the frequency parameters of the small wafers obtained after cutting, and thus cannot guarantee the frequency parameters of the small wafers obtained after cutting. Qualified Wafer

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