Improved printed circuit board (PCB) plating line

An electroplating device and copper plating technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of increasing wastewater treatment volume, unfavorable energy saving and emission reduction, and increasing production costs, so as to reduce wastewater treatment volume and reduce production Cost, water saving effect

Inactive Publication Date: 2011-12-28
昆山元茂电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the chuck and accompanying plating strip are removed from the nitric acid tank, a large amount of nitric acid is carried on it, and they are directly washed in the washing tank, so that the concentration of nitric acid in the washing tank increases rapidly. In order to better clean the chuck, it is often necessary to frequently replace the washing The water in the tank may be equipped with two or more washing tanks, which not only wastes a lot of water resources, increases the amount of wastewater treatment, but also increases production costs, which is not conducive to energy saving and emission reduction

Method used

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  • Improved printed circuit board (PCB) plating line
  • Improved printed circuit board (PCB) plating line

Examples

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Embodiment Construction

[0009] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0010] Such as figure 1 As shown, a kind of PCB electroplating device of the present invention comprises PCB copper plating / etching copper controller 1, hanger 2, chuck 3 on the hanger 2, and copper plating tank 4, the first washing tank 5, Nitric acid tank 6, drip tank 7, second washing tank 8, PCB copper plating / copper corrosion controller 1 is equipped with a corresponding control program to control the crane to drive the hanger 2 to run, and control the dripping of the hanger 2 on the drip tank 7 time.

[0011] work process:

[0012] According to the copper plating process, the PCB9 is clamped on the hanger 2 through the chuck 3 on the workbench, and the control program set in the PCB co...

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PUM

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Abstract

The invention discloses a printed circuit board (PCB) plating line. The PCB plating line comprises a PCB copper plating / etching controller (1), a rack (2), a copper plating bath (4), a first rising baths (5) and a second rising baths (8), and a nitric acid bath (6), wherein a chuck (3) on the rack (2) clamps a PCB; and the PCB copper plating / etching controller (1) controls a crown block to drive the rack (2) to run. The plating line is characterized in that: a dropping trough (7) is formed behind the nitric acid bath (6) and before the second rising bath (8) and is used for collecting a liquid medicament from the nitric acid bath (6); and a corresponding control program is arranged in the PCB copper plating / etching controller (1) for controlling the dropping time of the rack (2) on the dropping trough (7). The improved printed circuit board (PCB) plating line has a simple structure; and the dropping trough is formed in the PCB plating line for collecting the liquid medicament from the nitric acid bath, so the amount of the liquid medicament flowing into the subsequent rising bath is reduced, water resources are saved, the treatment amount of waste water is reduced, the production cost is lowered, energy is saved and emission is reduced.

Description

technical field [0001] The invention relates to a device for manufacturing printed circuits, in particular to a circuit board copper plating device. Background technique [0002] Printed circuit board (i.e. PCB), in the PCB copper plating process, the slots set on the PCB electroplating line include copper plating tanks, water washing tanks, nitric acid tanks, etc. The general copper plating process is to plate the PCB in the copper plating tank, Then wash in a water tank, remove the board after washing, then strip the clamp of the splint and the accompanying plating strips clamped on both sides during plating in a nitric acid tank to remove copper, and then wash in a water tank for reuse. After the chuck and accompanying plating strip are removed from the nitric acid tank, a large amount of nitric acid is carried on it, and they are directly washed in the washing tank, so that the concentration of nitric acid in the washing tank increases rapidly. In order to better clean t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18
Inventor 徐守杰韩业刚
Owner 昆山元茂电子科技有限公司
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