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Quaternary vertical light-emitting diode (LED) with current blocking structure and preparation method thereof

A technology of light-emitting diodes and current blocking, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as manufacturing difficulties and achieve the effect of improving luminous efficiency

Active Publication Date: 2011-12-21
QUANZHOU SANAN SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above method is often difficult to manufacture due to the consideration of the electrical properties of the material and the contact performance between the material and the window layer.

Method used

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  • Quaternary vertical light-emitting diode (LED) with current blocking structure and preparation method thereof
  • Quaternary vertical light-emitting diode (LED) with current blocking structure and preparation method thereof
  • Quaternary vertical light-emitting diode (LED) with current blocking structure and preparation method thereof

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Embodiment Construction

[0024] 下面结合附图和实施例对具有电流阻塞结构的四元系垂直发光二极管及其制备方法进一步说明。

[0025] Such as figure 1 所示,具有电流阻塞结构的四元系垂直发光二极管的制备方法,在GaAs衬底1上依次形成分布布拉格反射层2、第一型磊晶层3、发光层4及第二型磊晶层5;形成GaP窗口层6于第二型磊晶层5上;采用干蚀刻方法,形成表面呈凹陷的十字交叉状扩展条7的图形化GaP窗口层6,十字交叉状扩展条7的内环为圆形,直径为60um;十字交叉状扩展条7的外边为矩形,宽度为8um;十字交叉状扩展条7的凹陷深度为400nm,干法蚀刻采用的气体由Ar 2 , O 2 、BCl 3 , Cl 2 、SiCl 4 组成;在GaP窗口层6上80℃低温生长SiO 2 or Si 3 N 4 ,用于填充凹陷的十字交叉状扩展条7上;通过光罩、蚀刻、蒸镀作业,形成第一电极8于含SiO 2 的GaP窗口层上,第一电极8直径为95um;采用金刚砂轮切割一刀,切宽为50um,切深为40um;采用HF、NH 4 F, CH 3 COOH、H 2 SO 4 、H 2 o 2 溶液蚀刻通过十字交叉的电流扩展条7将第一电极8正下方的SiO 2 蚀刻掉,使第一电极8与图形化GaP窗口层6形成以空气为介质层的中空结构;在GaAs衬底1的背面蒸镀金属,形成第二电极9;切割二刀切穿后形成芯 grain.

[0026] 依上述方法制备的具有电流阻塞结构的四元系垂直发光二极管,如 figure 1 所示,包括GaAs衬底1;分布布拉格反射层2形成于GaAs衬底1上;第一型磊晶层3形成于分布布拉格反射层2上;发光层4形成于第一型磊晶层3上;第二型磊晶层5形成于发光层4上;表面呈凹陷的十字交叉状扩展条7的图形化GaP窗口层6形成于第二型磊晶层5上;第一电极8,形成于图形化GaP窗口层6正上方,与图形化GaP窗口层呈中空结构;第二电极9形成于GaAs衬底1背面。

[0027] from figure 1 with figure 2 中,可以看出在第一电极8与图形化GaP窗口层6正中间形成以空气为介质的交界面,当电流到达第一电极8时,利用空气作为电流阻塞结构,改变电流到达图形化GaP窗口层6的方向,改善芯片表面的的电流分布...

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Abstract

The invention relates to a quaternary vertical light-emitting diode (LED) with a current blocking structure and a preparation method thereof. In the quaternary vertical LED with the current blocking structure, a distributed Bragg reflecting layer is formed on a substrate; a first type epitaxial layer is formed on the distributed Bragg reflecting layer; a light-emitting layer is formed on the first type epitaxial layer; a second type epitaxial layer is formed on the light-emitting layer; a graphical (GaP) window layer of a concave-surface crosswise extending bar is formed on the second type epitaxial layer; a first electrode is formed over the GaP window layer; the first electrode and the GaP window layer have a hollow current blocking structure; and a second electrode is formed at the back of the substrate. After the conventional process is finished, the first electrode and the GaP window layer are formed into the hollow current blocking structure using air as a medium, so that the direction of the current from the light-emitting layer to a surface extending layer is changed, much more current are extended from the periphery of the GaP window layer and then converged to the electrodes, and the light-emitting efficiency of the LED is increased by 30 to 50 percent compared with that of the LED adopting the known technique.

Description

technical field [0001] The invention relates to a quaternary system vertical light emitting diode, in particular to a quaternary system vertical light emitting diode with a current blocking structure and a preparation method thereof. Background technique [0002] At present, light-emitting diodes have been widely used in display, decoration, communication and other fields, and their structure generally includes a substrate, a distributed Bragg reflection layer, a first epitaxial layer, a light-emitting layer, a second epitaxial layer, a window layer, and a first electrode. and the second electrode. By using different semiconductor materials and structures, light-emitting diodes can cover a full color range from ultraviolet to infrared, and their luminous efficiency and brightness are continuously improved. Improving the luminous efficiency of light-emitting diodes has always been the goal pursued by researchers, improving the quality of epitaxial materials, reducing the abs...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/14
Inventor 许亚红蔡家豪廖齐华邱姝颖陈文欣邱树添
Owner QUANZHOU SANAN SEMICON TECH CO LTD