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Method for producing silicon microphone

A technology of silicon microphones and manufacturing methods, applied in the direction of sensors, electrical components, etc., can solve the problems of complicated process, difficult to control the sensitivity and consistency of silicon microphones, and difficult to improve, so as to achieve simple processing technology, improve sensitivity and consistency Sexuality and low cost effect

Inactive Publication Date: 2011-01-26
AAC ACOUSTIC TECH (SHENZHEN) CO LTD +1
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Problems solved by technology

[0002] At present, in the manufacturing methods of silicon microphones based on semiconductor materials, thin films and back plates are formed by laminating single crystal silicon or polysilicon on silicon substrates, and these processes all deposit thin films first and then deposit back plates. Due to the multilayer structure deposition The process is complex, it is difficult to control the sensitivity and consistency of silicon microphones, and it is difficult to improve

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  • Method for producing silicon microphone
  • Method for producing silicon microphone
  • Method for producing silicon microphone

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Embodiment Construction

[0026] The manufacturing method of the silicon microphone of the present invention will be described in detail below with reference to the accompanying drawings. Such as Image 6 As shown, a silicon microphone includes a film 400 , a back plate 100 separated from the film 400 by a certain distance, and an isolation layer 300 sandwiched between the film 400 and the back plate 100 .

[0027] The manufacturing method of silicon microphone as described above comprises the following steps:

[0028] Step 1: If figure 1 As shown, a semiconductor substrate 1 is provided, and the semiconductor substrate 1 includes a first surface 11 and a second surface 12 opposite to the first surface 11 . The semiconductor substrate 1 can be selected as a single crystal silicon substrate. combine Image 6 As shown, the semiconductor substrate 1 is finally formed into a backplane 100 of a silicon microphone.

[0029] Step 2: If figure 2 As shown, the first surface 11 of the semiconductor substr...

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Abstract

The invention relates to a method for producing a silicon microphone, comprising the following steps of: providing a semiconductor substrate, wherein the semiconductor substrate comprises a first surface and a second surface relative to the first surface; doping on the first surface of the semiconductor substrate to form an impurity layer; depositing a sacrifice layer on the impurity layer; depositing a thin film layer on the sacrifice layer; patterning the thin film layer by using an etching technology; and releasing the whole structure with a hydrofluoric acid diluted solution to obtain the silicon microphone. The silicon microphone obtained by using the method for producing the silicon microphone has the advantages of high sensitivity and favorable consistency.

Description

【Technical field】 [0001] The invention relates to a method for manufacturing a silicon microphone, in particular to a method for manufacturing a silicon microphone based on semiconductor materials. 【Background technique】 [0002] At present, in the manufacturing methods of silicon microphones based on semiconductor materials, thin films and back plates are formed by laminating single crystal silicon or polysilicon on silicon substrates, and these processes all deposit thin films first and then deposit back plates. Due to the multilayer structure deposition The process is complex, it is difficult to control the sensitivity and consistency of silicon microphones and it is difficult to improve. [0003] Therefore, it is necessary to provide an improved silicon microphone manufacturing method to meet the application requirements. 【Content of invention】 [0004] The object of the present invention is to provide a method for manufacturing a silicon microphone with high sensitiv...

Claims

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Application Information

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IPC IPC(8): H04R31/00
Inventor 杨斌颜毅林
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD