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Method for manufacturing multilayer flexible printed wiring board and multilayer circuit matrix material

A base material, flexible printing technology, applied in the direction of printed circuit, multilayer circuit manufacturing, and the formation of electrical connection of printed components

Active Publication Date: 2011-01-26
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] (a) There is no through hole in the CSP mounting boss

Method used

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  • Method for manufacturing multilayer flexible printed wiring board and multilayer circuit matrix material
  • Method for manufacturing multilayer flexible printed wiring board and multilayer circuit matrix material
  • Method for manufacturing multilayer flexible printed wiring board and multilayer circuit matrix material

Examples

Experimental program
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Effect test

Embodiment 1

[0052] Figure 1A to Figure 1C It is a sectional structural view showing the manufacturing method of the wiring board of this invention.

[0053] First, if Figure 1A As shown in (1), prepare a double-sided circuit having copper films 2 and 3 with a thickness of 0.3 μm on both sides of a flexible insulating base material 1 (here, polyimide with a thickness of 12.5 μm) such as polyimide. Base material 4.

[0054] The thickness of the copper thin film is preferably 0.1 to 0.5 μm. When the thickness is less than 0.1 μm, film defects such as pinholes (pin holes) are likely to occur on the copper foil film, which adversely affects the formation of subsequent circuit patterns.

[0055] In addition, when it is thicker than 0.5 μm, when the circuit pattern is formed by a semi-additive method using the copper foil film as a seed layer, and then the seed layer is removed, the film of the circuit pattern is reduced due to etching and removal for each circuit pattern. If it is too lar...

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Abstract

The invention provides a method for manufacturing a multilayer flexible printed wiring board of a flexible cable, which can load narrow space CSP (chip size package) and an outer circuit and an inner circuit of which can form fine circuits, and a multilayer circuit matrix material for the multilayer flexible printed wiring board. The manufacturing method comprises the following steps of: preparing a double-side copper clad laminated plate, forming copper coatings with openings for through holes on the outer side and the inner side of the copper clad laminated plate by using an electrolytic copper plating method to ensure that the thickness of the copper coating on the inner side is two to three times that of the copper coating on the outer side, and forming a covering layer (11) on the copper coating on the inner side so as to form the laminated matrix material (12); and on the other hand, preparing a wiring matrix material (8) with at least one wiring layer, laminating the laminated matrix material to form a multilayer circuit matrix material (15), performing laser processing on the first and second openings of the multilayer circuit matrix material to form holes (16, 17) for communicating, and performing conductive treatment and electrolytic plating to form through holes (16b, 17b). The multilayer circuit matrix material is used in the manufacturing method.

Description

technical field [0001] The present invention relates to a manufacturing technology of a multilayer flexible printed wiring board, and more particularly to a method for manufacturing a multilayer flexible printed wiring board having a flexible cable portion that can be mounted in high density and a method for use in the multilayer flexible printed wiring board multilayer circuit substrate material. Background technique [0002] In recent years, the miniaturization and higher functionality of electronic equipment have been increasingly promoted, and therefore the demand for higher density of circuit boards has also been increasing. Therefore, by making the circuit board from one side into a multi-layered circuit board with double sides or three or more layers, the density of the circuit board is increased. [0003] As a part of this, multilayer circuit boards or hard circuit boards on which various electronic components are mounted are connected to each other through another ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/42H05K1/00
Inventor 松田文彦
Owner NIPPON MEKTRON LTD
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