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Hole wall processing agent for teflon substrate circuit board

A technology of Teflon base material and circuit board, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems of high equipment selectivity, high volatility, high content, etc., and achieve improved hydrophilicity sexual effect

Inactive Publication Date: 2013-02-06
SHENZHEN ZHENGTIANWEI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electroless copper plating process of circuit board production in the prior art cannot obtain high-quality copper plating in the hole of this material
And the treatment agent (PI treatment agent) of prior art has high organic solvent content, high volatility, high selectivity to equipment

Method used

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  • Hole wall processing agent for teflon substrate circuit board

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Embodiment Construction

[0008] In the first embodiment of the present invention, dimethylformamide is 90-95%, OP-10 is 2-5%, and polyvinyl chloride-polypropylene copolymer resin is 5-8%.

[0009] In the second embodiment of the present invention, dimethylformamide is 95-99%, OP-10 is 0.5-5%, and polyvinyl chloride-polypropylene copolymer resin is 0.5-5%.

[0010] In the best embodiment of the present invention, dimethylformamide 98.7%, OP-10 0.5%, polyvinyl chloride polypropylene copolymer resin 0.8%.

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PUM

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Abstract

The invention discloses a hole wall processing agent for a teflon substrate circuit board, which comprises the following components in percentage by weight: 90 to 99 percent of dimethylformamide, 0.1 to 5 percent of OP-10, and 0.5 to 8 percent of polrvinyl chloride polypropylene copolymer resin, and optimally 98.7 percent of the dimethylformamide, 0.5 percent of the OP-10, and 0.8 percent of the polrvinyl chloride polypropylene copolymer resin. In order to make the hole wall of a polytetrafluoroethylene substrate hydrophilic and favorable for subsequent chemical reactions, the hole wall is soaked in a chemical processing agent to obtain excellent hydrophilicity. The invention aims to provide the processing agent aiming at a copper plating process of the teflon substrate circuit board.

Description

technical field [0001] The invention relates to a treatment agent for the electroless plating pretreatment process in the production of circuit boards, especially a treatment agent for the hole wall of a Teflon-based circuit board. Background technique [0002] In the production of electronic appliances, for circuit boards whose base material is polytetrafluoroethylene (also known as Teflon or Teflon), because of the poor hydrophilicity of the base material, the aqueous solution cannot infiltrate it. The material is more resistant to chemical corrosion than other materials. Therefore, the electroless copper plating process of circuit board production in the prior art cannot obtain high-quality copper plating in the hole of the material. Moreover, the treating agent (PI treating agent) of the prior art has high organic solvent content, high volatility, and high selectivity to equipment. Contents of the invention [0003] In view of the shortcomings of the prior art, in or...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/30
Inventor 张本汉张元正
Owner SHENZHEN ZHENGTIANWEI TECH