Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate cleaning machine and substrate cleaning method

A technology for cleaning machines and substrates, which is used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as increased product defect rate and damage.

Inactive Publication Date: 2011-02-09
AU OPTRONICS CORP
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the cleaning effect of using the above-mentioned traditional cleaning method to clean the surface of the substrate on which the film layer has been formed accounts for about 1% to 1.5% of the defective rate of the existing products in production.
That is to say, when the above-mentioned cleaning method is used to clean the substrate, it is easy to cause damage to the film layer formed on the substrate during the cleaning process, thereby causing an increase in the defective rate of the product.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate cleaning machine and substrate cleaning method
  • Substrate cleaning machine and substrate cleaning method
  • Substrate cleaning machine and substrate cleaning method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] figure 1 is a schematic diagram of a substrate cleaning machine according to an embodiment of the present invention, figure 2 for figure 1 The local schematic diagram of the substrate cleaning machine, and image 3 for a suitable figure 1 A flow chart of the steps of the substrate cleaning method of the cleaning machine. Please also refer to figure 1 and figure 2 , the substrate cleaning machine 100 of this embodiment includes a first support 110 , a second support 120 , a continuous fabric 130 and a nozzle 140 . The first supporting member 110 and the second supporting member 120 are respectively disposed on the traveling path P1 of the substrate 150 , and the substrate 150 is adapted to pass over the first supporting member 110 and the second supporting member 120 sequentially along the traveling path P1 . In this embodiment, the first supporting member 110 and the second supporting member 120 are illustrated as rollers, but not limited thereto. In addition, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a substrate cleaning machine which comprises a first support part, a second support part, continuous fabric and a spray nozzle. The first support part and the second support part are respectively arranged on a traveling path of a substrate, and the substrate is applicable to sequentially pass above the first support part and the second support part along the traveling path. The continuous fabric is applicable to go forward along a feed direction, and the feed direction is reverse to a movement direction of the substrate. The first support part and the second support part are used for bearing the continuous fabric, thereby respectively forming a first cleaning area and a second cleaning area on the traveling path. The spray nozzle is applicable to spraying cleaningliquid on the continuous fabric in the first cleaning area. The invention also provides a substrate cleaning method.

Description

【Technical field】 [0001] The present invention relates to a cleaning machine and a cleaning method, and in particular to a substrate cleaning machine and a substrate cleaning method. 【Background technique】 [0002] Due to the rapid development of flat-panel display technology, its application has gradually extended from computer screens to home TVs. As far as the thin film transistor liquid crystal display (TFT-LCD) process is concerned, the cleaning step is often connected before, during, and after the coating, photolithography, and etching steps to maintain the surface cleanliness of the display substrate during the production process. [0003] The cleaning methods for the surface of the substrate include chemical and physical cleaning methods. For example, using the cilia on the surface of the rotating brush wheel to scrub the surface of the substrate to achieve the purpose of cleaning is a physical cleaning method. At present, most of the wet cleaning equipment used to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/00
Inventor 赖志明邵明良
Owner AU OPTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com