Method for manufacturing via stubs of circuit board
A manufacturing method and circuit board technology, which is applied in the direction of electrical connection formation of printed components, can solve the problems of board explosion, oil leakage, tin blowing, etc., and achieve the effect of smooth board surface and reduced difficulty
Active Publication Date: 2012-02-29
江西红板科技股份有限公司
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Problems solved by technology
[0003] At present, the blind and buried plug holes in the existing technology can no longer meet the technical requirements of the product. In order to further innovate the product, many existing printed circuit board products require that the outer layer via hole (VIA) should also be filled with copper. For this Requirements, the current industry can not use the form of electroplating, it often uses ink for sealing
However, the method of using ink to seal the hole is to plug the hole on both sides without opening the window. Opening windows on both sides will cause problems such as board explosion, tin blowing, and poor tinning when the product is surface mounted (SMT: Surface Mounted Technology), which will affect the yield of the product
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[0024] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0025] Such as figure 1 As shown, the present invention provides a kind of via hole manufacturing method of circuit board, and it comprises the following steps:
[0026] Step 1, providing a double-sided flexible circuit board 10, coating the adhesive agent 12 on the upper and lower sides of the double-sided flexible circuit board 10, and then applying the adhesive agent 12 to the double-sided flexible circuit board respectively. The upper and lower sides of the board 10 are sequentially pressed together with a double-sided substrate 14, a prepreg 16, and an outer layer copper plate 18 to form a circuit board ( figure 2 shown). As a preferred embodiment of the present invention, the double-sided substrate 14 is a double-sided glass cloth sub...
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The invention provides a method for manufacturing via stubs of a circuit board, comprising the following steps: step 1, providing a double-surface flexible circuit board, coating a sticking agent respectively at the two sides of the upper surface and the lower surface of the double-surface flexible circuit board, and laminating a double-surface substrate, a prepreg and an external layer copper plate in sequence respectively at the two sides of the upper surface and the lower surface of the double-surface flexible circuit board to form a circuit board through the sticking agent; step 2, drilling holes at the predetermined via stub positions on the circuit board; step 3, performing the secondary copper-clad plate electrofacing on the circuit board subject to drilling the holes; step 4, filling the via stubs with the liquid resin ink, and solidifying the filled via stubs for 60 to 90 minutes at the temperature of 120 to 180 DEG C; step 5, polishing the surface of the solidified circuit board; step 6, performing the copper-clad plate electrofacing again on the polished circuit board; and step 7, preparing a circuit on the circuit board. In the invention, the copper-clad plate electrofacing is performed after the filling of the via stubs by the liquid resin ink, which can achieve the smooth of the surface of the circuit board, thereby avoiding the problems of board explosion, tin blowing, poor tin soldering and the like caused by the via stub density during the SMT of the printed circuit board.
Description
technical field [0001] The invention relates to a method for making a hole, in particular to a method for making a via hole on a circuit board. Background technique [0002] With the rapid development of current electronic technology, the manufacturing process of printed circuit board (PCB: Printed Circuit Board), which is almost indispensable in electronic products, has also been greatly developed. The existing industry has higher and higher requirements for printed circuit boards, requiring more wires to be arranged in a narrow area to achieve high functionality of the product, resulting in a large number of blind, buried, and through-hole designs on printed circuit boards. [0003] At present, the blind and buried plug holes in the existing technology can no longer meet the technical requirements of the product. In order to further innovate the product, many existing printed circuit board products require that the outer layer via hole (VIA) should also be filled with copp...
Claims
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IPC IPC(8): H05K3/42
Inventor 岳林李泽勤肖开祥
Owner 江西红板科技股份有限公司