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Resin composition

A resin composition and resin technology, applied in the field of resin composition, can solve problems such as deformation, poor heat resistance of PETG, and dimensional change

Active Publication Date: 2013-04-17
MITSUBISHI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the poor heat resistance of PETG, when using PETG as the main raw material to make plastic cards, there are the following problems: under the action of heat, there will be dimensional changes or deformation, or curling, etc.

Method used

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  • Resin composition
  • Resin composition
  • Resin composition

Examples

Experimental program
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Effect test

Embodiment 1-5

[0079] The polycarbonate resin (A), polyester resin (B) and metal oxide (C) were mixed as shown in Table 1, and extruded by double-vented co-rotating twin-screws with a diameter of 65mm machine, at a set temperature of 260° C. to obtain a sheet with a thickness of 0.3 mm through a T-die extrusion method.

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Abstract

A resin composition including a polyester resin, e.g., PETG, and a polycarbonate resin. The resin composition is suitable for use as, e.g., a card material required to have heat resistance. The resin composition comprises: a polycarbonate resin (A); a polyester resin (B) obtained by condensation-polymerizing a dicarboxylic acid ingredient comprising terephthalic acid as the main component with a glycol ingredient comprising 80-60 mol% ethylene glycol as the main component and 20-40 mol% CHDM (the sum is 100 mol%); and a metal oxide (C). When the resin composition is examined for the dispersion of dynamic viscoelasticity with temperature under the conditions of a strain of 0.1%, frequency of 10 Hz, and heating rate of 3 °C / min, there is one main peak with respect to the dispersion of loss modulus and the temperature (Tg) at which the peak appears is in the range of 90-140°C.

Description

technical field [0001] The present invention relates to a resin composition usable as a heat-resistant material, for example, a resin composition usable as a raw material for a plastic card requiring heat resistance. Background technique [0002] Most plastic cards are made by laminating a white-pigmented veneer core sheet to a clear over sheet. As a raw material for these sheets, polyvinyl chloride (PVC) has been mainly used in the past, but polyester-based resins are now becoming the mainstream as environmental issues and other issues are increasingly emphasized. Among them, commonly used is a copolymerized polyester resin obtained by substituting about 30 mol % of the ethylene glycol component in a polyethylene terephthalate resin with 1,4-cyclohexanedimethanol (referred to as "PETG"). [0003] However, since PETG has poor heat resistance, when plastic cards are produced using PETG as the main raw material, there are problems in that dimensional changes, deformation, or...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L69/00C08K3/22C08L67/02
CPCC08L69/00C08K3/22C08L67/02C08L2666/18
Inventor 西川良树
Owner MITSUBISHI CHEM CORP