73results about How to "Excellent stress relaxation" patented technology

The present invention provides a pressure sensitive adhesive composition for optical members, which is excellent in durability, re-releasability and stress relaxation, as well as a pressure sensitive adhesive composition for optical members, which hardly increases adhesion after storage for a long time and does not leave a residual adhesive on glass upon disposal or repair. The pressure sensitive adhesive composition for optical members according to the present invention comprises 100 parts by weight of an acrylic polymer (A) having a weight-average molecular weight of 500,000 or more, containing at least 50 wt % alkyl (meth)acrylate having an alkyl group with 5 or more carbon atoms and 0.2 to 2 wt % unsaturated carboxylic acid as the monomer unit, 0.1 to 4 parts by weight of an acrylic polymer (B) having a weight-average molecular weight of 2,000 to 50,000, containing at least 70 wt % alkyl(meth)acrylate and 1 to 7 wt % unsaturated carboxylic acid as the monomer unit and having a higher carboxylic acid equivalent than that of the acrylic polymer (A), 0.01 to 1 part by weight of a silane coupling agent, and a crosslinking agent.

A copper alloy contains 0.01% to 1.0% of Fe, 0.01% to 0.4% of P, and 0.1% to 1.0% of Mg with the remainder being copper and inevitable impurities and has a volume fraction of dispersoids having a particle diameter exceeding 200 nm of 5% or less, in which dispersoids having a particle diameter of 200 nm or less and containing Mg and P have an average particle diameter of 5 nm or more and 50 nm or less. The copper alloy preferably has an average particle diameter of dispersoids containing Fe and P of 20 nm or less. The copper alloy has improved bendability and stress relaxation property.

A pressure-sensitive adhesive, comprising a polymer (A), which is formed by polymerization of a radical polymerizable monomer, contains carboxyl groups, and has a glass transition temperature within a range from −80 to 0° C. and a weight average molecular weight within a range from 500,000 to 1,500,000, a tricyclic diterpene carboxylic acid (B), and a curing agent (C) capable of reacting with a carboxyl group, wherein the total acid value of the combination of the polymer (A) and the tricyclic diterpene carboxylic acid (B) is within a range from 5 to 50 (mgKOH/g).

A multi-layer sheet material comprises a film, and adhesive layer and an optional release liner. The film is a polyester blend comprising first and second polyesters that are substantially amorphous and possess certain physical properties including softening temperature, E-modulus, elongation and residual stress.

It is an objective of the present invention to provide a composite sheet and a production method thereof, which composite sheet has excellent sealing ability, since the sheet exhibits high compressibility and yet low stress relaxation, as well as high strength and excellent pressure resistance. The objective of the present invention is also to provide a sheet gasket having the above-mentioned properties. The composite sheet according to present invention is characterized in that pores of an expanded porous PTFE sheet are filled with silica gel; and a ratio of remaining pores is not less than 5% and not more than 50%.

The invention provides a pressure sensitive adhesive composition with both excellent light-leak resistance and durability when applicable to optical components such as polarizer and the like, a manufacturing method of the pressure sensitive adhesive composition, a pressure sensitive adhesive and a pressure sensitive adhesive sheet. The pressure sensitive adhesive composition comprises a first (methyl) acrylate copolymer (A) with a weight average molecular weight of 700-2500 thousands, a second (methyl) acrylate copolymer (B) with a weight average molecular weight of 8-250 thousands, and a crosslinking agent (C), wherein the content of the second (methyl) acrylate copolymer (B) with respect to 100 parts by weight of the first (methyl) acrylate copolymer (A) is 5-50 parts by weight; the second (methyl) acrylate copolymer (B) contains a monomer which has a functional group (b1) with high reactivity with the crosslinking agent (C) and is used as a component element, and furthermore the content of the monomer in the second (methyl) acrylate copolymer (B) is more than 1 wt%; the first (methyl) acrylate copolymer (A) does not contain a monomer which has a functional group with reactivity with the crosslinking agent (C) and is used as a component element, or contains a monomer which has a functional group (a1) with lower reactivity with the crosslinking agent (C) than the functional group (b1) of the second (methyl) acrylate copolymer (B) and is used as a component element.

A photocurable resin composition including: (A) a urethane (meth)acrylate oligomer having a polyoxyalkylene structure, (B) a (meth)acrylic polymer, (C) a (meth)acrylic monomer, and (D) a photopolymerization initiator, wherein the component (A) is produced using monomer components including (a1) a polyoxyalkylene polyol, (a2) a polyisocyanate, and (a3) a hydroxyl group-containing mono(meth)acrylate compound, a relationship N (=n1/n2) between the total mass n1 of the monomer components and the total equivalent weight n2 of acryloyl groups within the all monomer components is 4,000 or greater, and the component (A) is substantially free of unreacted isocyanate groups.

A high power fuse includes a fuse body having a first terminal receptor including a first set of terminal legs and a second terminal receptor in spaced relation to the first terminal receptor. The second terminal receptor includes a second set of terminal legs. A fuse element is disposed between the first terminal receptor and the second terminal receptor. A first clamp-like member is mounted to the fuse body for applying a predetermined compression force against the first set of terminal legs and is configured to secure a first male terminal between the first set of terminal legs. A second clamp-like member is mounted to the fuse body for applying a predetermined compression force against the second set of terminal legs and is configured to secure a second male terminal between the second set of terminal legs.

The invention provides butyronitrile canvas filler rubber and a preparation method and application thereof. The butyronitrile canvas filler rubber is prepared by applying butyronitrile rubber mixture onto cotton canvas with the unit area weight of 550 to 600g/m<2> and the thickness of 0.62 to 0.66mm, the thickness of the butyronitrile canvas filler rubber is 0.8 to 0.85mm, and the content of the butyronitrile rubber mixture in percentage by mass is 38 to 42 percent. The method first prepares the butyronitrile rubber mixture, then dissolves the butyronitrile rubber mixture into solvent to prepare glue, and then applies the glue onto the cotton canvas to prepare the butyronitrile canvas filler rubber. The butyronitrile canvas filler rubber has high adhesive strength and good storage stability, and a V-shaped ring prepared form the rubber has the advantages of small single product height range and excellent size stability, and can be used for hydraulic cylinder pistons and piston rods with precise height size.

An adhesive composition, an adhesive, and an adhesive sheet are suitable for optical components such as a polarized sheet and have excellent stress relaxation property. The adhesive composition comprises monomer units which form a polymer, a (methyl) acrylate polymer (A) which has carboxyl-contained monomers and has weight-average molecular weight of being 500,000 to 3 million, and a reactive polyrotaxane compound (B) containing cyclic oligosaccharide having polymerized double bonds.

Provided are a substrate film and a method of manufacturing the substrate film. The substrate film may have excellent thermal resistance and dimensional stability, has excellent stress relaxation to prevent damage of a wafer caused by remaining stress, inhibits damage to or flying-off of the wafer caused by application of a non-uniform pressure during the processing of the wafer, and has excellent cuttability. Accordingly, the substrate film of the present invention can be effectively used as a processing sheet in a process of processing various kinds of wafers including dicing, back-grinding or picking-up.

Provided is a self-restoring macromolecular material that not only has excellent stress relaxation but that can also be easily restored to its original state, even when damaged or severed. Also provided is a method for producing the self-restoring macromolecular material. The self-restoring macromolecular material contains a crosslinked structure that is formed by crosslinking a polymer containing at least a polyrotaxane molecule. The polyrotaxane molecule is formed so as to include a cyclic molecule 21 and a linear molecule that passes through an opening 21a of the cyclic molecule. The crosslinked structure 1 is crosslinked via a reversible bond between the cyclic molecule of the polyrotaxane molecule and a polymer molecule other than the polyrotaxane molecule.

An adhesive composition which is the crosslinked product of components which comprise (C) a copolymer of a (meth)acrylic ester having a weight-average molecular weight of 1,000,000 or greater, (D) 5 to 100 parts by weight per 100 parts by weight of component (C) of an oligomer of (meth)acrylic esters having a weight-average molecular weight of 1,000 to 10,000 and (E) 0.001 to 50 parts by weight per 100 parts by weight of component (C) of a crosslinking component comprising a difunctional crosslinking agent. The adhesive composition exhibits excellent adhesion with adherents, and stress relaxation and follows changes in the dimensions of substrates.

A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.

A pressure-sensitive adhesive sheet including: a base material; and a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition that comprises a polyrotaxane (A) having at least two cyclic molecules and a linear-chain molecule passing through opening portions of the cyclic molecules wherein the cyclic molecules have each one or more reactive groups and the linear-chain molecule has blocking groups at both ends thereof, wherein the pressure-sensitive adhesive layer has an elongation at break of not smaller than 300% and a haze value of not greater than 30%, and a holding power of the pressure-sensitive adhesive sheet according to JIS Z0237, but at a measurement temperature of 80° C., is not greater than 1000 μm as the displacement of the pressure-sensitive adhesive sheet after 70,000 seconds.

When connecting with a conventional Zn/Al/Zn cladding material, thickness of a connecting part needs to be less than double an existing high-lead solder (about 100 μm) in order to make heat resistance in the connecting part at least equivalent to a level of the existing solder. Moreover, thickness of an Al layer needs to make as thick as possible in order to fully exhibit stress relaxation performance of the Al layer.

Provided is a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces.

The present invention addresses the problem of providing an adhesive agent which enables the production of an adhesive sheet that has excellent removability, is rarely raised from an adherend such as a glass or a plastic material or is rarely detached from the material after being exposed to a high-temperature environment or a high-temperature/high-humidity environment, has a good stress relaxation property, and rarely undergoes the occurrence of indentation on an adhesive agent layer formed therein. An adhesive agent comprising: an acrylic polymer (A) which does not have a hydroxyl group and has a carboxyl group; an acrylic polymer (B) which does not have a carboxyl group and has a hydroxyl group; at least one compound selected from an epoxy compound, a metal chelate compound and an aziridine compound; and a polyisocyanate compound.

A cross-linked foamed pressure sensitive adhesive having excellent stress relaxing property, restoration property and solvent resistance brought forth by uniform and sufficient cross-linking and foaming irrespective of transmissibility of ultraviolet rays and electron beams to components, and free from drawbacks inherent to low molecular weight acrylic copolymers. A cross-linked foamed pressure sensitive adhesive having restoration property, prepared by heating a heat cross-linkable and heat foamable composition containing a tacky polymer having a molecular weight of at least 100,000, a heat cross-linking agent and a heat foaming agent to cause cross-linking and foaming.

The present invention provides one kind of adhesive composition with excellent performances, especially high adhesion capacity and excellent heat tolerance, for semiconductor device and adhered sheet for semiconductor device. The adhesive composition for semiconductor device contains epoxy resin, phenolic resin, and ethylene copolymer containing ethylene and unsaturated carboxylic acid with functional group capable of reacting with the epoxy resin or its derivative. The adhesive composition has its dynamic viscoelasticity before curing measured to have lowest molten viscosity of 400-50,000 Pa.s.