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Binder composition for semiconductor device and binder sheet for semiconductor device

A composition, semiconductor technology, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesives, adhesive types, etc., can solve the problems of large operation volume and cost, electrical corrosion, insulation reduction, etc., to improve Reliability, labor reduction, and excellent reflow resistance

Inactive Publication Date: 2006-08-23
TOMOEGAWA PAPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] However, the management in the moisture-proof state requires a huge amount of work and cost, so there is a demand for an adhesive composition with excellent reflow resistance that can suppress the occurrence of popping during reflow soldering without the need for management in the moisture-proof state
[0020] In addition, since the adhesive is a material that contacts wiring, it is important to maintain electrical reliability with high insulation properties even in harsh environments. There are problems such as insulation degradation and electrical corrosion are prone to occur

Method used

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  • Binder composition for semiconductor device and binder sheet for semiconductor device
  • Binder composition for semiconductor device and binder sheet for semiconductor device
  • Binder composition for semiconductor device and binder sheet for semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～28、 comparative example 1～7

[0197] Examples 1-28, Comparative Examples 1-7 [Preparation of coating material of adhesive composition]

[0198]The (A) component, (B) component, (C) component or (C') component, (D) component, silane coupling agent, epoxy curing agent, filler, and diene-containing compound represented by symbols in Table 1 The copolymers were dissolved in toluene at room temperature to about 80° C. in the compounding amounts shown in Table 1 (mass % relative to the total solid content) to obtain coatings containing the adhesive composition (solid content concentration: 35% by mass %).

[0199] In addition, content of a filler is the part by mass (mass part) with respect to the sum total of 100 mass parts of (A) component, (B) component, (C) component or (C') component, and (D) component.

[0200] Moreover, the meaning of the symbol in Table 1 which shows the kind of each component used in Examples 1-28 and Comparative Examples 1-7 is shown in Table 2.

[0201] (quality%)

(p...

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Abstract

The present invention provides one kind of adhesive composition with excellent performances, especially high adhesion capacity and excellent heat tolerance, for semiconductor device and adhered sheet for semiconductor device. The adhesive composition for semiconductor device contains epoxy resin, phenolic resin, and ethylene copolymer containing ethylene and unsaturated carboxylic acid with functional group capable of reacting with the epoxy resin or its derivative. The adhesive composition has its dynamic viscoelasticity before curing measured to have lowest molten viscosity of 400-50,000 Pa.s.

Description

technical field [0001] The present invention relates to an adhesive composition for a semiconductor device and an adhesive sheet for a semiconductor device that are preferably used in a semiconductor device composed of various semiconductors. In particular, the present invention relates to a preferred combination of adhesives for semiconductor devices, surface-mount semiconductor devices, built-up substrates, etc., which have a structure in which IC chips are laminated on an IC substrate composed of an IC insulator layer and a conductive circuit. Articles and adhesive sheets, including those used for bonding IC chips, bonding heat sinks, or laminating IC substrates at a higher density, specifically, for bonding IC chips and circuit boards, for more Adhesive for high-density lamination between insulating layers of circuit boards, between FPCs with circuits formed, FPC and circuit boards, circuit boards and protective films, IC chips and heat sinks, heat sinks and circuit boards...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/06C09J7/00
Inventor 小林正治高柳一博吉井康弘桃内洋辅神谷友章
Owner TOMOEGAWA PAPER CO LTD
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