56results about How to "Excellent reflow resistance" patented technology

A multilayer anisotropic conductive adhesive in which resistance to reflow is sufficiently obtained and which can facilitate connection and a connection structure using the multilayer anisotropic conductive adhesive are provided. A multilayer anisotropic conductive adhesive 11 includes a plurality of adhesive layers 1 and 2 laminated, each of which at least contains an insulating resin and a hardening agent; wherein conductive particles are contained either in the plurality of adhesive layers 1 or in the plurality of adhesive layers 2, and at least the top or bottom adhesive layer 1 has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Further, a connection structure is constructed in which a first electronic component that has an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the above-described multilayer anisotropic conductive adhesive 11.

Polyimide resin containing repeating structural units represented by formula (1) and repeating constituent units represented by formula (2), having a content ratio of repeating constituent units of formula (1) to total repeating constituent units of formula (1) and repeating constituent units of formula (2) of from 20 mol% to less than 40 mol%, and satisfying predetermined conditions. (R1 is a divalent group having 6-22 carbon atoms containing at least one alicyclic hydrocarbon structure. R2 is a divalent chain aliphatic group having 5-16 carbon atoms. X1 and X2 are each independently a tetravalent group having 6-22 carbon atoms containing at least one aromatic ring.)

Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound.

The invention relates to an epoxy resin composition for encapsulation and electronic component device. The epoxy resin composition for encapsulation includes the components as following: (A) more than two epoxy resin with epoxy groups included in one molecule; (B) a hardening agent; and (C) diphenyl ketone derivatives with more than one phenolic group in one molecule. Perferably, the content of (C) is from 0.1 mass% to 1.0 mass%, and more perperably, (D) silane compound, (E) harding promoting agent and inorganic filler (F) are included.

The invention relates to a flame retarded epoxy resin composite material and is characterized in that the composite material comprises: (a) epoxide resin, (b) a hardening agent, (c) a flame retardant, (d) a hardening promoter and (e) an inorganic filling material. The flame retardant contains melamine cyanurate and cyclic phosphazene, wherein cyclic phosphazene has a following formula (I), in which R and m are defined as shown in the text. The flame retarded epoxy resin composite material of the invention not only has an excellent flame-retardant effect, but also can promote the adhersion, reflow soldering resistance and electric stability of epoxy resin materials, and is suitable for packaging of various components.

　Provided are: a curable resin composition provided with transparency, heat resistance, and flexibility, as well as with re-flow resistance, and also barrier properties with respect to hydrogen sulfide (H2S) gas and barrier properties with respect to sulfur oxide (SOX) gas, and that is useful in sealing applications for semiconductor elements (particularly optical semiconductor elements); a cured product using the same; a sealing material; and a semiconductor device. A curable resin composition, and a cured product, sealing material, and semiconductor device using the same, the curable resin composition including a polyorganosiloxane (A), an isocyanurate compound (B), and a zinc compound (E), the polyorganosiloxane (A) being a polyorganosiloxane having an aryl group, the curable resin composition potentially further including a silsesquioxane (D), and the content of the zinc compound (E) being less than 0.01 part by weight to 0.1 part by weight with respect to the total amount (100 parts by weight) of the polyorganosiloxane (A) and the silsesquioxane (D).

Provided are a curing resin composition which has transparency, heat resistance, and pliability, as well as having thermal shock resistance and reflow resistance, which moreover has barrier properties with respect to hydrogen sulfide (H2S) gas and sulfur oxide (SOX) gases, and which is useful in sealing applications for semiconductor elements (especially optical semiconductor elements); and a cured article, sealing material, and semiconductor device employing the same. Provided are a curing resin composition containing (A) a polyorganosiloxane, (B) a silsesquioxane, and (C) an isocyanurate compound, the polyorganosiloxane (A) being a polyorganosiloxane having an aryl group, and the curing resin composition having viscosity of 4,000-8,000 mPa*s; and a cured article, sealing material, and semiconductor device employing the same.

The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides a process for fabricating a resin-encapsulated semiconductor apparatus, comprising the steps of forming a film of a polyimide precursor composition on the surface of a semiconductor device having a ferroelectric film; heat-curing the polyimide precursor composition film to form a surface-protective film formed of a polyimide; and encapsulating, with an encapsulant resin, the semiconductor device on which the surface-protective film has been formed. The polyimide may preferably have a glass transition temperature of from 240° C. to 400° C. and a Young's modulus of from 2,600 MPa to 6 GPa. The curing may preferably be carried out at a temperature of from 230° C. to 300° C.

The invention relates to an environment-friendly epoxy molding compound and a preparation thereof, and belongs to the technical field of epoxy molding compounds. The environment-friendly epoxy molding compound is characterized in that: the epoxy molding compound contains a dicyclopentadiene phosphorus-containing epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a polyphosphazene compound; and the mass content of the dicyclopentadiene phosphorus-containing epoxy resin is between 1 and 20 percent. The preparation method is simple in process, convenient in processing, easy in control, low in production cost and high in production efficiency; the epoxy molding compound has good mouldability, reflux resistance and moisture resistance; and a product, namely the epoxy molding compound has the advantages of environmental protection, convenience in use, safety and reliability, good compatibility, good flame retardance and the like.

The present invention is to provide an epoxy resin composition for encapsulating a semiconductor having a high flame resistance without using a flame retarder and having an excellent solder reflow resistance, and a semiconductor device using the same for encapsulating a semiconductor element. An epoxy resin composition for encapsulating a semiconductor of each of the first, second and third aspects essentially comprises (A) a phenol aralkyl type epoxy resin having a phenylene structure, (B) a phenol aralkyl type phenolic resin having a biphenylene structure and (D) an inorganic filler as common components, wherein (D) the inorganic filler is contained at the rate of 84 wt % or more and 92 wt % or less of the total amount of the epoxy resin composition.

The invention relates to an epoxy molding compound for high thermal conductivity and high magnetic induction packaging, wherein the epoxy molding compound is prepared from an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a demolding agent, a modifier and a composite coupling agent. According to the invention, after the epoxy molding compound is subjected to 260 DEG reflowsoldering, the epoxy molding compound can meet the JEDEC level 2 reliability requirement, the layering rate is less than 5%, and the epoxy molding compound has excellent formability, excellent reflowresistance and excellent reliability; and the obtained epoxy molding compound is used for high-thermal-conductivity magnetic induction packaging bodies, is uniform in crystallization, has unique high-magnetic-conductivity performance, and has good low-magnetic-conductivity loss.

Provided is an epoxy resin based molding material for sealing, said molding material comprising (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a mono- or di-hydric phenol derivative containing one or more nitrile groups in the molecular structure. It is preferable that the content of the mono- or di-hydric phenol derivative (C) is 0.1 to 1.0% by mass. Further, it is preferable that the molding material contains (D) a silane compound, (E) a cure accelerator, and / or (F) an inorganic filler. Also provided is an electronic part or device that is provided with an element sealed with the epoxy resin based molding material.

The present invention relates to an epoxy resin composition for semiconductor encapsulation and a semiconductor device using the same. The composition includes following components (A) to (E): (A) a bifunctional epoxy resin, (B) a curing agent, (C) an imidazole compound represented by the formula (1), in which R1 and R2 each independently represent an alkyl group or an alkylol group, in which at least one of R1 and R2 represents an alkylol group, and R3 represents an alkyl group or an aryl group, (D) a linear saturated carboxylic acid having a number average molecular weight of 550 to 800, and (E) an inorganic filler.

A multilayer anisotropic conductive adhesive a plurality of adhesive layers that are laminated, each of which contains an insulating resin and a hardening agent. The conductive particles are contained either in a first plurality of adhesive layers or in a second plurality of adhesive layers, and at least the top or bottom adhesive layer has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Also, a connection structure is constructed in which a first electronic component having an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the multilayer anisotropic conductive adhesive.

Provided is an adhesive for a semiconductor that contains an epoxy resin, a curing agent, and a compound having the group represented by formula (1). [In the formula, R1 indicates an electron-donating group.]

Provided is a curable epoxy resin composition capable of forming a cured product that has heat resistance, light resistance, and thermal shock resistance at high levels and particularly offers excellent reflow resistance after moisture absorption. The curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by Formula (1), a curing agent (C), and a curing accelerator (D). The composition includes methylnorbornane-2,3-dicarboxylic anhydride as an essential component of the curing agent (C) and has a succinic anhydride content of 0.4 percent by weight or less based on the total amount of the curing agent (C):wherein R1 and R2 are identical or different and each represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.

The present invention provides one kind of adhesive composition with excellent performances, especially high adhesion capacity and excellent heat tolerance, for semiconductor device and adhered sheet for semiconductor device. The adhesive composition for semiconductor device contains epoxy resin, phenolic resin, and ethylene copolymer containing ethylene and unsaturated carboxylic acid with functional group capable of reacting with the epoxy resin or its derivative. The adhesive composition has its dynamic viscoelasticity before curing measured to have lowest molten viscosity of 400-50,000 Pa.s.

The present invention relates to an adhesive composition for encapsulating connection parts in a semiconductor device in which respective connection parts of a semiconductor chip and a wiring circuit board are electrically connected with each other or alternatively in a semiconductor device in which respective connection parts of a plurality of semiconductor chips are electrically connected with each other. The adhesive composition contains an epoxy resin, a curing agent and an acrylic surface-treated filler.

An optical waveguide photosensitive resin composition containing an aliphatic resin having a polymerizable substituent and a photopolymerization initiator, in which the aliphatic resin having the polymerizable substituent is formed of a side-chain polyfunctional aliphatic resin (A) and a bifunctional long-chain aliphatic resin (B), is provided. Accordingly, the composition brings together high transparency, satisfactory roll-to-roll compatibility, and a high resolution patterning property, and has excellent reflow resistance. Therefore, the composition is useful as a material for forming an optical waveguide, especially a core layer-forming material.

The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burden on the environment. Specifically, the present invention provides an electrically conductive adhesive film that contains metal particles, a thermosetting resin and a compound having Lewis acid properties or a heat acid generator, wherein the compound having Lewis acid properties or the heat acid generator is characterized by being selected from among boron fluoride or a complex thereof, a protic acid having a pKa value of -0.4 or lower, or a salt or acid obtained by combining the same anion as the salt of the protic acid with a hydrogen ion or other cation. In addition, the present invention provides a dicing and die bonding film obtained by bonding the electrically conductive adhesive film to a pressure-sensitive adhesive tape.

The invention relates to an epoxy molding compound for packaging a tantalum capacitor and a manufacturing method for the epoxy molding compound, and belongs to the technical field of epoxy molding compounds. The epoxy molding compound for packaging the tantalum capacitor is characterized by comprising the following components in percentage by mass: 3 to 10 percent of multifunctional epoxy resin, 1 to 5 percent of multifunctional phenolic resin, 0.5 to 3 percent of reactive diluent, 0.5 to 2 percent of stress-releasing agent, 0.1 to 1 percent of accelerant and 70 to 90 percent of mineral filler. The manufacturing method comprises the following steps of: adding the components of the epoxy molding compound into a mixer, mixing the components uniformly, extruding the mixture by using a twin-screw extruder at the temperature of between 100 and 150 DEG C, cooling, crushing and performing pre-press molding to obtain the epoxy molding compound for packaging the tantalum capacitor. The epoxy molding compound for packaging the tantalum capacitor is halogen-free and antimony-free, can package tantalum capacitors at low temperature and under low pressure, and is low in stress, and high in moldability, relux resistance, wet resistance and reliability; the manufacturing method is convenient to operate, high in production efficiency, safe and reliable, and product quality is stable; and the epoxy molding compound is particularly suitable for packaging a polymer solid chip tantalum capacitor.

The curable resin composition according to the present invention includes a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C), and a silane coupling agent (D). The polyorganosiloxane (A) is a polyorganosiloxane approximately devoid of aryl groups. The silsesquioxane (B) includes a ladder-like silsesquioxane. The curable resin composition has excellent heat resistance, transparency and flexibility. It offers superior reflow resistance and barrier properties to a corrosive gas.

The purpose of the present invention is to provide a curable epoxy resin composition capable of yielding a cured product which has high transparency, heat resistance, light resistance and crack resistance and which exhibits excellent reflow-resistant properties (excellent heat resistance during reflow operations). This curable resin composition is characterized by comprising (A) an alicyclic epoxy compound, (B) a monoallyl diglycidyl isocyanurate compound represented by formula (1), (C) a polycarbonate polyol, and (D) a curing agent or (E) a curing catalyst. In formula (1), R1 and R2 are each a hydrogen atom or C1-8 alkyl.

Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains:(A) an epoxy resin being solid at 25° C.;(B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond;(C) an inorganic filler; and(D) an anionic curing accelerator.

The invention relates to an environment-friendly epoxy molding compound and a preparation thereof, and belongs to the technical field of epoxy molding compounds. The environment-friendly epoxy molding compound is characterized in that: the epoxy molding compound contains a dicyclopentadiene phosphorus-containing epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a polyphosphazene compound; and the mass content of the dicyclopentadiene phosphorus-containing epoxy resin is between 1 and 20 percent. The preparation method is simple in process, convenient in processing, easy in control, low in production cost and high in production efficiency; the epoxy molding compound has good mouldability, reflux resistance and moisture resistance; and a product, namely the epoxy molding compound has the advantages of environmental protection, convenience in use, safety and reliability, good compatibility, good flame retardance and the like.