54results about How to "Excellent reflow resistance" patented technology

The invention relates to an epoxy resin composition for encapsulation and electronic component device. The epoxy resin composition for encapsulation includes the components as following: (A) more than two epoxy resin with epoxy groups included in one molecule; (B) a hardening agent; and (C) diphenyl ketone derivatives with more than one phenolic group in one molecule. Perferably, the content of (C) is from 0.1 mass% to 1.0 mass%, and more perperably, (D) silane compound, (E) harding promoting agent and inorganic filler (F) are included.

　Provided are: a curable resin composition provided with transparency, heat resistance, and flexibility, as well as with re-flow resistance, and also barrier properties with respect to hydrogen sulfide (H2S) gas and barrier properties with respect to sulfur oxide (SOX) gas, and that is useful in sealing applications for semiconductor elements (particularly optical semiconductor elements); a cured product using the same; a sealing material; and a semiconductor device. A curable resin composition, and a cured product, sealing material, and semiconductor device using the same, the curable resin composition including a polyorganosiloxane (A), an isocyanurate compound (B), and a zinc compound (E), the polyorganosiloxane (A) being a polyorganosiloxane having an aryl group, the curable resin composition potentially further including a silsesquioxane (D), and the content of the zinc compound (E) being less than 0.01 part by weight to 0.1 part by weight with respect to the total amount (100 parts by weight) of the polyorganosiloxane (A) and the silsesquioxane (D).

Provided are a curing resin composition which has transparency, heat resistance, and pliability, as well as having thermal shock resistance and reflow resistance, which moreover has barrier properties with respect to hydrogen sulfide (H2S) gas and sulfur oxide (SOX) gases, and which is useful in sealing applications for semiconductor elements (especially optical semiconductor elements); and a cured article, sealing material, and semiconductor device employing the same. Provided are a curing resin composition containing (A) a polyorganosiloxane, (B) a silsesquioxane, and (C) an isocyanurate compound, the polyorganosiloxane (A) being a polyorganosiloxane having an aryl group, and the curing resin composition having viscosity of 4,000-8,000 mPa*s; and a cured article, sealing material, and semiconductor device employing the same.

The invention relates to an environment-friendly epoxy molding compound and a preparation thereof, and belongs to the technical field of epoxy molding compounds. The environment-friendly epoxy molding compound is characterized in that: the epoxy molding compound contains a dicyclopentadiene phosphorus-containing epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a polyphosphazene compound; and the mass content of the dicyclopentadiene phosphorus-containing epoxy resin is between 1 and 20 percent. The preparation method is simple in process, convenient in processing, easy in control, low in production cost and high in production efficiency; the epoxy molding compound has good mouldability, reflux resistance and moisture resistance; and a product, namely the epoxy molding compound has the advantages of environmental protection, convenience in use, safety and reliability, good compatibility, good flame retardance and the like.

Provided is a curable epoxy resin composition capable of forming a cured product that has heat resistance, light resistance, and thermal shock resistance at high levels and particularly offers excellent reflow resistance after moisture absorption. The curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by Formula (1), a curing agent (C), and a curing accelerator (D). The composition includes methylnorbornane-2,3-dicarboxylic anhydride as an essential component of the curing agent (C) and has a succinic anhydride content of 0.4 percent by weight or less based on the total amount of the curing agent (C):

wherein R¹ and R² are identical or different and each represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.

The present invention provides one kind of adhesive composition with excellent performances, especially high adhesion capacity and excellent heat tolerance, for semiconductor device and adhered sheet for semiconductor device. The adhesive composition for semiconductor device contains epoxy resin, phenolic resin, and ethylene copolymer containing ethylene and unsaturated carboxylic acid with functional group capable of reacting with the epoxy resin or its derivative. The adhesive composition has its dynamic viscoelasticity before curing measured to have lowest molten viscosity of 400-50,000 Pa.s.

Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains:

• • (A) an epoxy resin being solid at 25° C.;
  • (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond;
  • (C) an inorganic filler; and
  • (D) an anionic curing accelerator.