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Epoxy resin composition for encapsulation and electronic component device

A technology of epoxy resin and composition, applied in the direction of epoxy resin glue, electrical components, electrical solid devices, etc., can solve the problems of low fluidity, pinholes, voids, etc., and achieve excellent reflow resistance and high adhesion Effect

Active Publication Date: 2012-07-18
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although this method reduces the moisture absorption in the sealing part inside the semiconductor device, it has a problem that the fluidity of the epoxy resin composition for sealing is greatly reduced.
If the fluidity of the epoxy resin composition for sealing is low, problems such as gold wire fluidity, voids, and pinholes may occur during molding

Method used

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  • Epoxy resin composition for encapsulation and electronic component device
  • Epoxy resin composition for encapsulation and electronic component device
  • Epoxy resin composition for encapsulation and electronic component device

Examples

Experimental program
Comparison scheme
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preparation example Construction

[0218]

[0219] The epoxy resin composition for sealing of the present invention may be prepared by any method as long as it can uniformly disperse and mix various components. As a usual method, there may be mentioned a method of sufficiently mixing components in predetermined amounts with a mixer or the like, and then melting and kneading with a kneader, extruder or the like, followed by cooling and pulverization. For example, it can be obtained by uniformly stirring and mixing predetermined amounts of the above-mentioned components, kneading, cooling, pulverizing, and the like with a kneader, roll, extruder, etc. previously heated to 70°C to 140°C. It is easier to use if it is formed into a sheet with a size and quality corresponding to the molding conditions.

[0220]

[0221] As an electronic component device equipped with an element sealed with the epoxy resin composition for sealing obtained by the present invention, mounting of a semiconductor chip on a support memb...

Embodiment

[0225] The present invention will be described below by way of examples, but the scope of the present invention is not limited by these examples. In addition, "%" means "mass %" unless otherwise stated.

[0226]

[0227] The following components were mixed in parts by mass shown in the following Tables 1 to 6, and roll kneading was carried out at a kneading temperature of 80°C and a kneading time of 10 minutes to prepare Examples 1 to 24 and Comparative Examples 1-24 epoxy resin composition for sealing. In addition, the empty column in a table|surface shows non-combination.

[0228] As (A) epoxy resin, use:

[0229] Epoxy resin 1: a biphenyl type epoxy resin (trade name YX-4000 manufactured by Japan Epoxyresin Co., Ltd.) having an epoxy equivalent of 196 g / eq and a melting point of 106° C.,

[0230] Epoxy resin 2: a biphenylene skeleton-containing phenol-aralkyl type epoxy resin (trade name CER-3000L manufactured by Nippon Kayaku Co., Ltd.) with an epoxy equivalent of 240...

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Abstract

The invention relates to an epoxy resin composition for encapsulation and electronic component device. The epoxy resin composition for encapsulation includes the components as following: (A) more than two epoxy resin with epoxy groups included in one molecule; (B) a hardening agent; and (C) diphenyl ketone derivatives with more than one phenolic group in one molecule. Perferably, the content of (C) is from 0.1 mass% to 1.0 mass%, and more perperably, (D) silane compound, (E) harding promoting agent and inorganic filler (F) are included.

Description

technical field [0001] The present invention relates to an epoxy resin composition for sealing, and an electronic component device including an element sealed with the epoxy resin composition for sealing. Background technique [0002] Conventionally, epoxy resin compositions for sealing have been widely used in the field of sealing electronic components such as transistors and ICs. The reason for this is that the epoxy resin can achieve a balance of electrical characteristics, moisture resistance, heat resistance, mechanical characteristics, adhesion to inserts, and the like. In particular, the combination of an ortho-cresol novolak-type epoxy resin and a novolak-type phenol curing agent is excellent in the balance of the above-mentioned characteristics, and has become the mainstream of the base resin of the sealing composition. [0003] With the miniaturization, light weight, high performance of electronic instruments in recent years, and the high density of installation, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K5/132C08G59/62C09J163/00C09J11/06H01L23/29
CPCC08K2201/003C08L2203/206C08L2205/025C09J11/04C09J11/06C09J163/00H01L23/295C08L63/00C08K13/04C08K5/132C08K5/54C08K7/18H01L2924/0002H01L2924/00C08G59/22C08G59/621H01L23/293
Inventor 田中贤治滨田光祥古泽文夫
Owner 株式会社力森诺科
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