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Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material

A technology of epoxy resin and molding materials, which is applied in the direction of epoxy resin glue, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of labor and time, reduced packaging reliability, and reduced fluidity, and achieve reliable High performance, excellent reflow resistance, and improved adhesion

Active Publication Date: 2013-07-24
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, when the package absorbs moisture, there is a problem that peeling of the adhesive interface and package cracks occur due to the rapid expansion of the moisture absorbed during soldering, which reduces the reliability of the package during mounting.
[0004] As a countermeasure to solve the above-mentioned problems, in order to reduce the moisture absorption inside the semiconductor device, methods such as moisture-proof packaging of the IC, drying the IC before mounting on the wiring board, etc. (for example, refer to Semiconductor Business Division, Hitachi, Ltd. Edited "Mounting Technology and Improvement of Reliability of Surface Mount Type LSI Package", Applied Technology Publication, November 16, 1988, pp. 254-256), however, these methods require labor and time, and the cost also increases
As another countermeasure, there is a method of increasing the filler content, but in this method, although the moisture absorbed inside the semiconductor device is reduced, there is a problem that the fluidity is greatly reduced

Method used

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  • Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material
  • Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material
  • Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material

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Embodiment

[0223] The following examples illustrate the present invention in detail, but the present invention is not limited to these examples. In addition, unless otherwise specified, "%" is a mass standard.

[0224] Preparation of epoxy resin molding material for sealing

[0225] The following components were blended in parts by mass shown in the following Tables 1 to 8, and roll kneaded at a kneading temperature of 80°C and a kneading time of 10 minutes to prepare Examples 1 to 31 and Comparative Examples 1 to 10. 31 for sealing with epoxy resin molding compound. In addition, an empty column ("-") in the table indicates no fit.

[0226] As (A) epoxy resin, the following were used.

[0227] Epoxy resin 1: epoxy equivalent 196, the biphenyl type epoxy resin (Mitsubishi Chemical Corporation product name YX-4000) of melting point 106 degreeC.

[0228] Epoxy resin 2: a biphenylene skeleton-containing phenol-aralkyl type epoxy resin having an epoxy equivalent of 241 and a softening poi...

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Abstract

Provided is an epoxy resin based molding material for sealing, said molding material comprising (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a mono- or di-hydric phenol derivative containing one or more nitrile groups in the molecular structure. It is preferable that the content of the mono- or di-hydric phenol derivative (C) is 0.1 to 1.0% by mass. Further, it is preferable that the molding material contains (D) a silane compound, (E) a cure accelerator, and / or (F) an inorganic filler. Also provided is an electronic part or device that is provided with an element sealed with the epoxy resin based molding material.

Description

technical field [0001] The present invention relates to an epoxy resin molding material for sealing and an electronic component device having an element sealed with the molding material. Background technique [0002] Conventionally, epoxy resin molding materials have been widely used in the field of sealing electronic components such as transistors and ICs. The reason for this is that the epoxy resin balances electrical characteristics, moisture resistance, heat resistance, mechanical characteristics, adhesiveness to the insert, and the like. In particular, combinations of ortho-cresol novolac-type epoxy resins and novolak-type phenolic curing agents have become the mainstream of base resins for sealing molding materials because they are excellent in the balance of the above characteristics. [0003] In recent years, with the miniaturization, weight reduction, and high performance of electronic equipment, and the advancement of high-density mounting, electronic component de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08K3/00C08K5/315C08K5/54C08L63/00H01L23/29H01L23/31
CPCC08K5/315C08G59/621C09J163/00H01L23/293C08L63/00H01L2924/0002H01L2924/00
Inventor 田中贤治滨田光祥古泽文夫
Owner HITACHI CHEM CO LTD
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