Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material

Abstract

Provided is an epoxy resin based molding material for sealing, said molding material comprising (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a mono- or di-hydric phenol derivative containing one or more nitrile groups in the molecular structure. It is preferable that the content of the mono- or di-hydric phenol derivative (C) is 0.1 to 1.0% by mass. Further, it is preferable that the molding material contains (D) a silane compound, (E) a cure accelerator, and / or (F) an inorganic filler. Also provided is an electronic part or device that is provided with an element sealed with the epoxy resin based molding material.

Description

technical field [0001] The present invention relates to an epoxy resin molding material for sealing and an electronic component device having an element sealed with the molding material. Background technique [0002] Conventionally, epoxy resin molding materials have been widely used in the field of sealing electronic components such as transistors and ICs. The reason for this is that the epoxy resin balances electrical characteristics, moisture resistance, heat resistance, mechanical characteristics, adhesiveness to the insert, and the like. In particular, combinations of ortho-cresol novolac-type epoxy resins and novolak-type phenolic curing agents have become the mainstream of base resins for sealing molding materials because they are excellent in the balance of the above characteristics. [0003] In recent years, with the miniaturization, weight reduction, and high performance of electronic equipment, and the advancement of high-density mounting, electronic component de...

AI Technical Summary

Problems solved by technology

As a result, when the package absorbs moisture, there is a problem that peeling of the adhesive interface and package cracks occur due to the rapid expansion of the moisture absorbed during soldering, which reduces the reliability of the package during mounting.

[0004] As a countermeasure to solve the above-mentioned problems, in order to reduce the moisture absorption inside the semiconductor device, methods such as moisture-proof packaging of the IC, drying the IC before mounting on the wiring board, etc. (for example, refer to Semiconductor Business Division, Hitachi, Ltd. Edited "Mounting Technology and Improvement of Reliability of Surface Mount Type LSI Package", Applied Technology Publication, November 16, 1988, pp. 254-256), however, these methods require labor and time, and the cost also increases

As another countermeasure, there is a method of increasing the filler content, but in this method, although the moisture absorbed inside the semiconductor device is reduced, there is a problem that the fluidity is greatly reduced

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