Epoxy molding compound for high thermal conductivity and high magnetic induction packaging, preparation method and applications thereof
An epoxy plastic encapsulant, high magnetic induction technology, applied in the field of materials, can solve problems such as affecting product reliability, popcorn occurrence, poor inductance performance, etc., to ensure thermal conductivity and magnetic induction performance, reduce water absorption, and eliminate curing. effect of stress
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[0065] The preparation method of the epoxy molding compound for packaging with high thermal conductivity and high magnetic induction as described above, the steps are as follows:
[0066] The components are uniformly mixed by a high-speed mixer, extruded by a twin-screw extruder at 80-150°C, cooled and pulverized, and then pre-pressed to obtain an epoxy molding compound for packaging with high thermal conductivity and high magnetic induction.
[0067] The application of the above-mentioned epoxy molding compound for packaging with high thermal conductivity and high magnetic induction in packaging.
Embodiment 1
[0069] Weigh each component according to the ratio in Table 1, mix them evenly, melt and knead the mixed material in a twin-screw extruder at 80°C, press the tablet and cool it down, crush it, pre-press it with a cake maker, and test the product performance indicators.
Embodiment 2
[0071] Weigh the components according to the ratio in Table 1, mix them evenly, melt and knead the mixed materials in a twin-screw extruder at 100°C, press the pellets and cool them down, crush them, pre-press them with a cake maker, and test the product performance indicators.
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