Epoxy molding compound for high thermal conductivity and high magnetic induction packaging, preparation method and applications thereof

An epoxy plastic encapsulant, high magnetic induction technology, applied in the field of materials, can solve problems such as affecting product reliability, popcorn occurrence, poor inductance performance, etc., to ensure thermal conductivity and magnetic induction performance, reduce water absorption, and eliminate curing. effect of stress

Pending Publication Date: 2020-02-11
天津凯华绝缘材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It makes it easy to delaminate between the plastic packaging compound and the chip, and in severe cases, it will cause the product to crack or even popcorn, which greatly affects the reliability of the product
At the same time, the size reduction of inductive devices is limited, and the current packaging products have poor thermal conductivity, low magnetic permeability, and poor inductive performance.

Method used

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  • Epoxy molding compound for high thermal conductivity and high magnetic induction packaging, preparation method and applications thereof
  • Epoxy molding compound for high thermal conductivity and high magnetic induction packaging, preparation method and applications thereof
  • Epoxy molding compound for high thermal conductivity and high magnetic induction packaging, preparation method and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0065] The preparation method of the epoxy molding compound for packaging with high thermal conductivity and high magnetic induction as described above, the steps are as follows:

[0066] The components are uniformly mixed by a high-speed mixer, extruded by a twin-screw extruder at 80-150°C, cooled and pulverized, and then pre-pressed to obtain an epoxy molding compound for packaging with high thermal conductivity and high magnetic induction.

[0067] The application of the above-mentioned epoxy molding compound for packaging with high thermal conductivity and high magnetic induction in packaging.

Embodiment 1

[0069] Weigh each component according to the ratio in Table 1, mix them evenly, melt and knead the mixed material in a twin-screw extruder at 80°C, press the tablet and cool it down, crush it, pre-press it with a cake maker, and test the product performance indicators.

Embodiment 2

[0071] Weigh the components according to the ratio in Table 1, mix them evenly, melt and knead the mixed materials in a twin-screw extruder at 100°C, press the pellets and cool them down, crush them, pre-press them with a cake maker, and test the product performance indicators.

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PUM

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Abstract

The invention relates to an epoxy molding compound for high thermal conductivity and high magnetic induction packaging, wherein the epoxy molding compound is prepared from an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a demolding agent, a modifier and a composite coupling agent. According to the invention, after the epoxy molding compound is subjected to 260 DEG reflowsoldering, the epoxy molding compound can meet the JEDEC level 2 reliability requirement, the layering rate is less than 5%, and the epoxy molding compound has excellent formability, excellent reflowresistance and excellent reliability; and the obtained epoxy molding compound is used for high-thermal-conductivity magnetic induction packaging bodies, is uniform in crystallization, has unique high-magnetic-conductivity performance, and has good low-magnetic-conductivity loss.

Description

technical field [0001] The invention belongs to the technical field of materials, in particular to an epoxy molding compound for packaging with high thermal conductivity and high magnetic induction, and a preparation method and application thereof. Background technique [0002] Epoxy molding compound is mainly composed of epoxy resin, crosslinking curing agent, curing accelerator and additives. Because of its many outstanding characteristics, such as good thermal stability, insulation, adhesion, good mechanical properties, excellent molding process performance and low cost, it is widely used in the field of electronic component packaging, and then It has become one of the most important electronic chemical materials at present. In recent years, with the continuous development of advanced microelectronics technology, electronic packaging has become increasingly thinner and thinner. The traditional powder packaging and solvent-containing liquid packaging are gradually replac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/04C08L83/06C08L83/10C08L91/06C08K9/00C08K3/22C08K5/5435C08K5/544C08K3/08C08K13/06H01L23/29C09K5/14
CPCC08L63/00C08L2205/025C08L2205/03C08L2205/035C09K5/14H01L23/293C08L83/04C08L83/06C08L83/10C08L91/06C08K9/00C08K3/22C08K5/5435C08K5/544C08K13/06C08K3/08
Inventor 赵生领张旭东任开阔
Owner 天津凯华绝缘材料股份有限公司
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