Method for machining microcrack or micropore array and product thereof

Abstract

The invention discloses a method for machining a microcrack or micropore array and a product thereof, which are mainly used for microcracked or microperforated sound absorbing plates. The method comprises the following steps of: splicing strip-shaped materials to form a plane or curved surface; controlling crack width to obtain a microcrack array; and overlapping two layers to obtain a micropore array. The product comprises an array body which is spliced, wherein a shallow crack is formed by splicing transparent materials such as glass and the like and solid bodies or hollow tubes with non-rectangular sections; and the depth of the crack or pore is less than the thickness of the material or array through staggered splicing and can be adjusted within a range from 0 to 100 percent. The thickness of the array can be more than 5mm. Decorative bodies and lighting bodies in the transparent tubes of the array body also form color, pattern, character or matrix, are connected in a specific mode and driven by a preset program. By using the splicing method, machining efficiency is improved, and the transparent, clean, environmental-friendly, noncombustible, high-efficiency, attractive and multifunctional array body is made of high-hardness and high-brittleness material such as the glass and the like.

Description

technical field [0001] The invention relates to the technical field of material processing, in particular to a processing method of a microslit or microhole array and an array body product. Background technique [0002] Micro-slit or micro-hole array is the key structure of micro-perforated or micro-perforated panel sound absorber and other micro-slit applications, but it is difficult to process: [0003] First of all, the processing cost is high. It is necessary to create dense micro-holes or micro-slits on the plate. Regardless of punching, drilling, needle piercing, laser drilling, and chemical corrosion, there are problems of low processing efficiency and high cost. [0004] Secondly, it may pollute the environment (chemical waste liquid). [0005] Third, it is difficult or impossible to process ultra-hard, corrosion-resistant, and ultra-thick materials, such as glass. [0006] Micro-perforated and micro-perforated panel sound-absorbing body is an environmentally frien...

AI Technical Summary

Problems solved by technology

[0003] First of all, the processing cost is high. It is necessary to manufacture dense micro-holes or micro-slits on the plate. Regardless of punching, drilling, needle piercing, laser drilling, and chemical corrosion, there are problems of low processing efficiency and high cost.

[0004] Secondly, it may pollute the environment (chemical waste liquid)

[0005] Third, it is difficult or impossible to process ultra-hard, corrosion-resistant, and ultra-thick materials, such as glass

[0007] First of all, modern buildings have an urgent need for non-combustible and transparent glass structure sound absorbers, while architectural glass is super hard, corrosion-resistant, super thick, and difficult to process

[0008] Secondly, the micro-perforated and micro-perforated panels made of ultra-thick materials have too deep micro-holes and micro-slits, resulting in a decrease in sound absorption performance.

[0009] Third, the appearance is single and the decoration is insufficient

Images