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Transfer device and processing system having the same

A conveying device and processing system technology, applied in the field of processing systems, can solve the problems of difficult control of multiple substrate temperatures, large temperature differences, long reheating time, etc., and achieve the effect of shortening the reheating time

Inactive Publication Date: 2011-03-23
TOKYO ELECTRON LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are cases where the temperature of the substrate drops while the substrate is being transported from the preheating chamber to the processing chamber, and the reheating time in the processing chamber is long.
[0006] Furthermore, in the batch method in which a plurality of substrates are processed at a time, there are cases where the temperature difference between the uppermost substrate, the lowermost substrate, and the middle substrate in which heated substrates exist above and below is large, making it difficult to increase the temperature. Precisely control the individual temperatures of multiple substrates

Method used

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  • Transfer device and processing system having the same
  • Transfer device and processing system having the same
  • Transfer device and processing system having the same

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Embodiment Construction

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In all the drawings referred to, the same reference numerals are attached to the same parts.

[0019] In this description, a large glass substrate for manufacturing solar cells and FPDs is cited as an example of the object to be processed, and a processing system for performing predetermined processing such as etching or film formation on the large glass substrate will be described as an example.

[0020] figure 1 It is a top view schematically showing the processing system of one embodiment of the present invention.

[0021] Such as figure 1 As shown, the processing system 1 of one embodiment includes: a common conveying chamber 10; a preheating chamber 20, which is connected to the common conveying chamber 10, and is used for preheating the object G to be processed; processing chambers 30a, 30b, which For performing etching, film formation, etc. on the object to be...

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Abstract

The present invention provides a transfer device and a processing system using the same, capable of reducing a time required to re-heat a target substrate to be processed in a processing chamber while controlling the temperature of each of a plurality of substrates with high accuracy even when the substrates are transferred at a time. The transfer device includes a base; and a substrate supporter for supporting one or more target substrates to be processed. The substrate supporter is forwardly and backwardly moved to transfer the target substrates. The transfer device further includes reflecting bodies provided at least above and below the substrate supporter, the reflecting bodies serving to reflect heats radiated from the target substrates supported by the substrate supporter.

Description

technical field [0001] The present invention relates to a transport device for transporting an object to be processed, such as a large substrate used in a solar cell, and a processing system for processing the object including the transport device. Background technique [0002] In the manufacturing process of flat panel displays (FPDs) represented by solar cells and liquid crystal displays (LCDs), there are known processing chambers that include predetermined processing such as etching or film formation on large glass substrates one by one, and the A monolithic multi-chamber processing system in which a substrate is preheated to a preprocessing temperature in a preheating chamber (for example, Patent Document 1). [0003] Such a processing system has a common transfer chamber provided with a transfer device for transferring large substrates (objects to be processed), a load-lock vacuum chamber for exchanging objects before and after processing, the above-mentioned preheatin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677C23C16/46
CPCH01L21/67754H01L21/67742B65G49/061G02F1/1303H01L21/67115H01L21/67248Y10S414/139
Inventor 山田洋平
Owner TOKYO ELECTRON LTD
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