Biface smart card and manufacture method thereof

Abstract

The invention discloses a manufacture method of a biface smart card. The manufacture method comprises following steps: 1, punching a conductive bonding pad accommodating hole on a middle sandwich layer (4); 2, loading a conductive bonding pad; 3, embedding wires and welding; 4, piling up and laminating; 5, utilizing a slotter to mill a first-layer groove (8) and a second-layer groove (9) on a clamp body (11) through one step; 6, milling two conductive holes; 7, filling a conducting material (12) into the two conductive holes (10); and 8, finally packaging to form the biface smart card. The biface smart card provided by the invention has the following advantages: the conductive bonding pad is connected with a chip through the conducting material which has more reliable quality and lower cost than those of the existing conductive adhesive; and in addition, an antenna is connected with the conductive bonding pad though a wire embedding machine, such butt-joint process is widely used in contactless cards at present, and the quality is quite stable.

Description

technical field [0001] The invention relates to the field of smart cards, in particular to a dual-interface smart card and a manufacturing method thereof. Background technique [0002] The dual-interface smart card is a CPU card that integrates two communication interfaces, contact and non-contact. It combines the advantages of contact and non-contact IC cards, and has the characteristics of large storage capacity, strong reliability, high security, and strong applicability, so it is widely used in finance, telecommunications, public transportation, social insurance and other fields. [0003] As a new technology, the dual-interface smart card also has its special requirements for card packaging. There are two main packaging processes currently used: conductive adhesive process and butt welding process. Due to the processing technology and conductive rubber problems of the conductive adhesive process, the connection between the antenna and the contact of some cards is unsta...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problems of unstable quality, low production efficiency and high cost of the existing dual-interface smart card, the present invention provides a dual-interface smart card and a manufacturing method thereof. The antenna in the card body is directly connected to the conductive pad, and can Directly use the wire embedding machine to complete the embedding and welding content synchronously. There are two conductive holes drilled at the conductive connection at both ends of the chip. The bottom of the two conductive holes are respectively connected to the conductive pads. The two conductive holes are filled with conductive materials.

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