Biface smart card and manufacture method thereof

The technology of a dual-interface smart card and its manufacturing method, which is applied in the field of smart cards, can solve the problems of low production efficiency, high cost, unstable quality of dual-interface smart cards, etc., and achieve the effect of reliable quality, stable quality and low cost

Active Publication Date: 2011-04-20
WUHAN TIANYU INFORMATION IND
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problems of unstable quality, low production efficiency and high cost of the existing dual-interface smart card, the present invention provides a dual-interface smart card and a manufacturing method thereof. The antenna in the card body is directly connected to the conductive pad, and can Directly use

Method used

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  • Biface smart card and manufacture method thereof
  • Biface smart card and manufacture method thereof
  • Biface smart card and manufacture method thereof

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Example Embodiment

[0027] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0028] A method for making a dual-interface smart card includes the following steps:

[0029] Step 1: Punch the conductive pad to place the hole. See figure 2 , On the core layer 4 in the card body 11, punch out two conductive pad placement holes A and B, the punching area is located in the position area of ​​the groove 8 to be milled in the subsequent groove milling process, And avoid the location area of ​​the second-level groove 9.

[0030] The shape of the hole is determined according to the shape of the conductive pad. In this embodiment, the two holes are opposite to the "mouth" shape, the hole size is controlled at 2.5*2.5mm, and the center of hole A is 9.5±0.3 from the left edge of the card body. mm, the distance from the upper edge of the card body is 23.9±0.3mm, hole A and hole B are arranged in parallel, and the distance between the two hol...

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Abstract

The invention discloses a manufacture method of a biface smart card. The manufacture method comprises following steps: 1, punching a conductive bonding pad accommodating hole on a middle sandwich layer (4); 2, loading a conductive bonding pad; 3, embedding wires and welding; 4, piling up and laminating; 5, utilizing a slotter to mill a first-layer groove (8) and a second-layer groove (9) on a clamp body (11) through one step; 6, milling two conductive holes; 7, filling a conducting material (12) into the two conductive holes (10); and 8, finally packaging to form the biface smart card. The biface smart card provided by the invention has the following advantages: the conductive bonding pad is connected with a chip through the conducting material which has more reliable quality and lower cost than those of the existing conductive adhesive; and in addition, an antenna is connected with the conductive bonding pad though a wire embedding machine, such butt-joint process is widely used in contactless cards at present, and the quality is quite stable.

Description

technical field [0001] The invention relates to the field of smart cards, in particular to a dual-interface smart card and a manufacturing method thereof. Background technique [0002] The dual-interface smart card is a CPU card that integrates two communication interfaces, contact and non-contact. It combines the advantages of contact and non-contact IC cards, and has the characteristics of large storage capacity, strong reliability, high security, and strong applicability, so it is widely used in finance, telecommunications, public transportation, social insurance and other fields. [0003] As a new technology, the dual-interface smart card also has its special requirements for card packaging. There are two main packaging processes currently used: conductive adhesive process and butt welding process. Due to the processing technology and conductive rubber problems of the conductive adhesive process, the connection between the antenna and the contact of some cards is unsta...

Claims

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Application Information

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IPC IPC(8): G06K19/08
Inventor 舒强
Owner WUHAN TIANYU INFORMATION IND
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