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Laser direct-compounding micro-plastic forming device and method

A laser direct and micro-plastic technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as batching of products that cannot be solved, and achieve the effect of large flexibility, good repeatability, and accurate and controllable parameters

Inactive Publication Date: 2011-04-27
JIANGSU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The patented laser shock forming method and device and the patented laser shock forming strengthening system method and device cannot solve the problem of mass production of products and the synchronization of edge trimming, punching and punching in the process of laser shock manufacturing parts. Composite process

Method used

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  • Laser direct-compounding micro-plastic forming device and method
  • Laser direct-compounding micro-plastic forming device and method
  • Laser direct-compounding micro-plastic forming device and method

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Embodiment Construction

[0026] Combine below figure 1 Describe in detail the details and working conditions of the specific device proposed by the present invention.

[0027] The installation consists of 13 parts. The computer 12 controls the laser controller 10, and the laser controller 10 adjusts the laser parameters emitted by the nanosecond laser 11 according to the actual situation. The laser light emitted by the nanosecond laser 11 is transmitted to the total reflection mirror 7 and the lens 6 sequentially through the laser beam 9 and finally transmitted to the sample body 5 below the lens 6 . The sample body 5 is placed in the jig 4 , and the jig 4 is installed on the vertical moving platform 3 . The horizontal mobile platform 2 and the vertical mobile platform 3 are installed on the L-shaped base 1, and the displacement adjustment of the horizontal mobile platform 2 and the vertical mobile platform 3 is regulated by a mobile platform controller 13 controlled by a computer 12 . The specific...

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Abstract

The invention discloses a laser direct-compounding micro-plastic forming device and method, belonging to the technical field of parts of a laser processing micro-electromechanical system (MEMS). The device comprises a laser loading system, a forming system and a control system. The method comprises the following steps: laser penetrates through a restraint layer after being focused by lens and acts on an energy-absorbing layer; the energy-absorbing layer absorbs the laser energy; a high pressure and high temperature plasmasphere is formed in a very short period of time and sprayed outward quickly; the expanded plasmas are limited by the restraint layer, so that the plasma pressure increases quickly and causes impact loading on a workpiece; the workpiece is extruded between the restraint layer and a compound micro-mould, so that the workpiece generates plastic deformation and copies the appearance of the compound micro-mould; and a compound process of stretching, punching and trimming a target workpiece is realized in one impact forming process by a stretching female mould, a trimming female mould and a punching male mould which are arrayed on the compound micro-mould, and simultaneously workpieces can be formed in batch.

Description

technical field [0001] The invention belongs to the technical field of laser processing micro-electromechanical system (MEMS) parts, in particular to a laser micro-forming method and device. Background of the invention [0002] In recent years, with the gradual rise of micro-nano technology and the continuous development of the miniaturization trend in electronic products, micro-mechanical technology with its own small size or small operating size has become a high-tech technology for people to understand the microscopic field and transform the objective world. technology. Especially with the continuous progress of society and the improvement of people's living standards, people's requirements for daily life products are becoming increasingly intelligent, miniaturized, and multi-functional integrated, which makes full consideration in the process of designing and manufacturing products. to the requirements of the above functions. [0003] With the trend of product miniatur...

Claims

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Application Information

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IPC IPC(8): B21D26/06B23K26/00
Inventor 王霄王鹤军刘会霞沈宗宝李品陶茂科许贞凯宋新华张成黄志辉郑远远李威王凯张虎
Owner JIANGSU UNIV
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