Light-emitting diode (LED) plane light source

A technology of LED surface light source and LED chip, which is applied in the field of light source, can solve the problems of not simplifying the production process, and achieve the effects of easy automation, improved processing efficiency, and high processing efficiency

Active Publication Date: 2011-04-27
四川科芯照明股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the technical scheme of using copper clad laminates as circuit boards is proposed, which can increase the heat dissipation effect o

Method used

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  • Light-emitting diode (LED) plane light source
  • Light-emitting diode (LED) plane light source
  • Light-emitting diode (LED) plane light source

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0023] Embodiment 1 of the present invention, such as figure 1 As shown, the structure of a LED surface light strip strip has: the guide wire first power supply external lead electrode 1; the LED chip 2 of the strip strip; the LED chip positive pad 4 of the strip strip; The negative electrode pad 5 of the LED chip of the chip; the chip connection wire 3 of the positive electrode pad 4 and the negative electrode pad 5 of different LED chips 2 connected in series;

[0024] Such as figure 2 As shown, the mixed phosphor colloidal coating 7 coated on the plate-shaped heat good conductor mirror plate 16 and the LED chip 2 of the strip cloth, wherein the heat good conductor mirror plate 16 can be a mirror aluminum plate or a copper plate nickel-plated Such as metal mirror panels or mirror panels of ceramic materials; and colloid lenses 8 mixed with fluorescent powder colloidal coating 7 strips of cloth; PECC film 9 of strip cloth; electrodes of strip cloth are introduced into insul...

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PUM

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Abstract

The invention relates to a light-emitting diode (LED) plane light source, which is characterized in that a bearing body of light-emitters (chips) is the mirror surface of a hot good conductor mirror plate and is the light extraction side of the chips; the chips are stuck to a transparent thermally conductive insulating paste thin film coating at the mirror side of the hot good conductor mirror plate by electrically conductive silver paste; and the chips are connected with each other by directly connecting positive and negative leads with pads on the LED chips. Due to the reflecting function of the mirror of the hot good conductor mirror plate, the light extraction efficiency of the light extraction ends of the LED chips and the illuminance of the light emitting end are greatly improved. PECC treatment is carried out on the surface of the non-light extraction end of the hot good conductor mirror plate, thus further improving the heat dissipation conditions of the LED plane light source. The procedures causing environmental pollution such as etching are eliminated after removing the metal core printed circuit board (MCPCB). The chips are directly connected in series by leads, thus greatly improving the processing efficiency while saving the materials. The optical system and the heat dissipating system of the whole LED plane light source system are established on a more perfect platform while the cost is lowered.

Description

Technical field: [0001] The invention relates to a light source used in lighting appliances, especially a light source using LED as a luminous body. Each luminous body (chip) is connected in series to form a luminous body group and then connected in parallel. The mirror surface of the good conductor mirror plate is the LED surface light source on the light emitting side of the chip. technical background: [0002] As a light source for lighting appliances, the traditional method of using LED chips as a light source is to separate the LED lamp beads for light separation and color separation, and then connect them in series to form illuminant groups and then integrate them in parallel to form modules. The other is to paste the chip on the MCPCB (metal core PCB) board where the circuit processing is completed on the copper-clad board after the board-making etching, and then attach the chip electrode to the MCPCB board. The copper-clad film wiring board on the etching circuit is...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V19/00F21V23/06F21V7/22F21V29/00H01L25/03H01L33/48H01L33/64F21Y101/02F21V29/50F21V29/89
CPCH01L2224/48137
Inventor 陈炜旻
Owner 四川科芯照明股份有限公司
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