Two-sided metal based circuit board and production method thereof

A double-sided metal and metal substrate technology, which is applied in the direction of printed circuit components, electrical connection printed components, and printed component electrical connection formation, to achieve the effect of reducing circuit board structure problems

Active Publication Date: 2011-04-27
广东省华锐高新材料股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of the above situation, the present invention provides a novel double-sided metal-based circuit board, which solves the ...

Method used

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  • Two-sided metal based circuit board and production method thereof
  • Two-sided metal based circuit board and production method thereof

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Embodiment Construction

[0018] Such as figure 1 As shown, a double-sided metal-based circuit board proposed by the present invention includes a metal substrate 1 made of aluminum, a heat-conducting insulating layer 2 covering both sides of the metal substrate 1, and a circuit layer covering the outside of the heat-conducting insulating layer 2 3 (copper foil), a through hole 4 is opened on the circuit board, and a thermally conductive insulating resin with an expansion coefficient similar to that of aluminum is selected as the insulator 5 to fill the through hole 4 . Then in the center of the insulator 5, a via hole 6 with a diameter smaller than that of the via hole 4 is drilled, so that a layer of resin is reserved on the inner wall of the via hole 4 as an insulating layer. Copper is then plated on this layer of resin to connect the upper and lower copper foils to form a conductive layer 7 connected to the circuit layer 3 . In this way, the conductive layer 7 and the aluminum substrate 1 are separ...

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Abstract

The invention discloses a two-sided metal based circuit board which comprises a metal base plate, a heat conducting insulating plate covering two sides of the metal base plate and a circuit layer covering the outer side of the heat conducting insulating layer, wherein a through hole is arranged on the circuit board and filled with an insulating body, a conducting hole is arranged in the insulating body, and a conductive layer communicated with the circuit board layer covers the inner wall of the conducting hole. The invention also provides a production method used for the circuit board, which comprises the following steps of: drilling the base plate, filling the through hole with insulating resin, covering the heat conducting insulating layer and the circuit board layer on the metal base plate sequentially, drilling the middle of the resin filled in the through hole, and plating copper on the inner wall of the hole to form the conducting layer. The two-sided metal based circuit board provided by the invention can effectively solve the insulation problem of the metal base plate and the circuit board layer during circuit board drilling and wire jumping, realizes wire jumping in the hole, and reduces the circuit board structure problem needing considering when the circuit is designed.

Description

technical field [0001] The invention relates to a circuit board, in particular to a double-sided metal base circuit board and a production method thereof. Background technique [0002] The basic structure of the existing double-sided metal circuit board is that the metal substrate (usually made of aluminum) is covered with insulators on both sides of the center, and the circuit layer (usually copper foil) is covered on the insulator. Because the metal base in the middle only acts as a structural enhancement for heat dissipation and cannot be energized, the copper foils on both sides can conduct electricity. However, in circuit design, the copper foils on both sides often need to be connected and conducted. This problem can be solved by drilling holes on the circuit board when using ordinary circuit boards, and then using jumpers or copper plating to connect the copper foils on both sides. However, when using metal-based circuit boards, jumping wires in the holes will cause ...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/42
Inventor 廖萍涛张守金萧哲力
Owner 广东省华锐高新材料股份有限公司
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