Metal layer structure of flexible multilayer base plate and preparation method thereof

A technology of multi-layer substrate and manufacturing method, which is applied in the direction of multi-layer circuit manufacturing, improvement of metal adhesion of insulating substrate, printed circuit manufacturing, etc., to achieve the effect of high reliability

Active Publication Date: 2011-05-04
PRINCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to study a metal layer structure of a flexible multilayer substrate and its manufacturing method, which can still be effectively solved when the thickness of the flexible multilayer substrate is further thinned and the thickness of the metal layer is also thinner. For the aforementioned problems, the metal layer structure is not easy to delaminate or separate from the contacted dielectric layer, which has higher reliability

Method used

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  • Metal layer structure of flexible multilayer base plate and preparation method thereof
  • Metal layer structure of flexible multilayer base plate and preparation method thereof
  • Metal layer structure of flexible multilayer base plate and preparation method thereof

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Embodiment Construction

[0016] The specific implementation of the metal layer structure of the flexible multi-layer substrate and its manufacturing method provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0017] Please refer to the attached image 3 Shown is a schematic cross-sectional view of the first embodiment of the metal layer structure of the flexible multi-layer substrate of the present invention. In this embodiment, the metal layer structure of the flexible multilayer substrate is used as hole pads, and the flexible multilayer substrate is used for packaging and bonding an IC (not shown). The metal layer structure of the flexible multi-layer substrate includes a first metal layer 300 having a body 302 , an embedding 304 and a second dielectric layer 308 . The flexible multilayer substrate also has a first dielectric layer 200 underneath it, such as image 3 As shown, the body 302 is located above the base 304 , and the bottom...

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Abstract

the invention relates to a metal layer structure of a flexible multilayer base plate. The structure comprises a first metal layer and a dielectric layer, wherein the first metal layer contains a body and an embedding base; the body is positioned above the embedding base; and the bottom area of the embedding base is larger than that of the body. After the dielectric layer is cladded on of the body and the embedding base the first metal layer, the first metal layer is provided with a through-hole to ensure that the body of the first metal layer is connected with a second metal layer on the dielectric layer. The body and the embedding base can be integrated and formed at the same time. When the metal layer structure in the invention is used as a pore cap or metal circuit of the flexible multilayer base plate, the metal layer structure has small possibility of delaminating or separating with the contacted dielectric layer and the metal layer structure has higher reliability.

Description

【Technical field】 [0001] The invention relates to a metal layer structure of a multilayer substrate and a manufacturing method thereof, in particular to a metal layer structure of a flexible multilayer packaging substrate and a manufacturing method thereof. 【Background technique】 [0002] Multilayer substrates are used in the production of packaging substrates, printed circuit boards, flexible packaging substrates, and flexible circuit boards. Integration into high-density systems is an inevitable trend for the miniaturization of electronic products today, especially the use of flexible multilayer substrates to make flexible packaging structures. It can be more effectively applied to various products and meets the needs of miniaturization. The thinner the flexible multilayer substrate, the higher the routing density of the multilayer substrate, and the finer the size requirements of the metal layer structure of the flexible multilayer substrate. The flexible multi-layer sub...

Claims

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Application Information

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IPC IPC(8): H05K1/05H05K3/38H01L23/48H01L21/48
CPCH01L2224/11H05K1/111H05K1/118H05K3/048H05K3/4007H05K2201/0367H05K2201/098H05K2201/09845H05K2201/099H05K2203/0588H05K2203/0594H05K3/38H05K3/46
Inventor 杨之光
Owner PRINCO CORP
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