Metal layer structure of flexible multilayer base plate and preparation method thereof
A technology of multi-layer substrate and manufacturing method, which is applied in the direction of multi-layer circuit manufacturing, improvement of metal adhesion of insulating substrate, printed circuit manufacturing, etc., to achieve the effect of high reliability
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[0016] The specific implementation of the metal layer structure of the flexible multi-layer substrate and its manufacturing method provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0017] Please refer to the attached image 3 Shown is a schematic cross-sectional view of the first embodiment of the metal layer structure of the flexible multi-layer substrate of the present invention. In this embodiment, the metal layer structure of the flexible multilayer substrate is used as hole pads, and the flexible multilayer substrate is used for packaging and bonding an IC (not shown). The metal layer structure of the flexible multi-layer substrate includes a first metal layer 300 having a body 302 , an embedding 304 and a second dielectric layer 308 . The flexible multilayer substrate also has a first dielectric layer 200 underneath it, such as image 3 As shown, the body 302 is located above the base 304 , and the bottom...
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