Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip-like electric component and method for manufacturing the same

A technology of electrical components and electrical components, applied in the direction of electrical components, resistor manufacturing, resistor components, etc.

Inactive Publication Date: 2011-05-11
HOKURIKU ELECTRIC INDS
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in a resistor with a relatively small size, there are cases where the electrodes and the resistor body are formed only by thin film formation technology.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip-like electric component and method for manufacturing the same
  • Chip-like electric component and method for manufacturing the same
  • Chip-like electric component and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Hereinafter, embodiments of the chip-shaped electrical component of the present invention will be described in detail with reference to the drawings. figure 1 It is a cross-sectional view schematically showing the structure of a chip resistor 1 which is one type of chip-like electrical component manufactured by the manufacturing method of the chip-like electrical component of the present invention. figure 1 This is a cross-sectional view schematically shown for easy understanding, and the dimensional ratio of each part, the thickness and shape of each layer are different from those of an actual member. figure 2 (A) to (F) are shown figure 1 A process diagram of a plurality of steps in the manufacturing method of the chip resistor 1 according to the embodiment. use figure 2 process diagrams, while describing the manufacturing method of the chip resistor 1 of this embodiment, together with figure 1 The structure of the chip resistor 1 will be described.

[0023] exi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is a chip-like electric component, such as a chip resistor, which is easily manufactured even without increasing cost and eliminates cracks and breakage of an insulating substrate. A pair of surface electrodes (21, 23) are formed such that the thickness increases from a resistive layer (13) toward a pair of ends (30) of an insulating substrate (29) positioned in a direction where the pair of surface electrodes (21, 23) are arranged. A plating accumulating section (S) is formed between the surface electrodes (21, 23) and the insulating protection layer (15). At the time of forming one or more plating layers (33), a plating metal is accumulated in the plating accumulating section (S), and steps formed between the soldering electrode sections (21, 23, 27, 33) and the insulating protection layer (15) can be made small to a certain extent by the plating layer (33).

Description

technical field [0001] The present invention relates to a chip-shaped electrical component and a manufacturing method thereof. Background technique [0002] In chip resistors, which are one type of relatively large chip-shaped electrical components, resistors and the like are formed with thick films, and all electrodes for soldering are also formed with thick films. In addition, in a resistor having a relatively small size, electrodes and resistors may be formed only by a thin film forming technique. In addition, in resistors with a relatively small size, soldering electrodes may be formed by a combination of a thick film and a thin film. [0003] In the method of manufacturing a chip resistor described in Japanese Unexamined Patent Application Publication No. 63-172401 (Patent Document 1), in order to obtain individual chip substrates, an alumina substrate for multiple acquisition that can be cut and separated is used. First, a plurality of thick-film resistor layers made...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01C7/00H01C1/012H01C17/06
CPCH01C1/06H01C7/003H01C17/006H01C17/06506Y10T29/49155
Inventor 竹内胜己野村丰黑川宽幸
Owner HOKURIKU ELECTRIC INDS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products