Chip-like electric component and method for manufacturing same

Abstract

A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodes 21, 23 are formed so that thicknesses of the pair of surface electrodes increase from a resistor layer 13 toward end portions 30 of an insulating substrate 29 in a direction in which the pair of surface electrodes 21, 23 are arranged. A plating reservoir S is formed between one of the surface electrodes 21, 23 and an insulating protective layer 15. When forming at least one plated layer 33, a plated metal pools in the plating reservoir S. The at least one plated layer 33 may work to reduce to some extent a height difference between a soldering electrode portion 21, 23, 27, 33 and the insulating protective layer 15.

Description

technical field

[0001] The present invention relates to a chip-shaped electrical component and a manufacturing method thereof. Background technique

[0002] In chip resistors, which are one type of relatively large chip-shaped electrical components, resistors and the like are formed with thick films, and all electrodes for soldering are also formed with thick films. In addition, in a resistor having a relatively small size, electrodes and resistors may be formed only by a thin film forming technique. In addition, in resistors with a relatively small size, soldering electrodes may be formed by a combination of a thick film and a thin film.

[0003] In the method of manufacturing a chip resistor described in Japanese Unexamined Patent Application Publication No. 63-172401 (Patent Document 1), in order to obtain individual chip substrates, an alumina substrate for multiple acquisition that can be cut and separated is used. First, a plurality of thick-film resistor layers made...

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