Method for manufacturing radiator and radiator

A manufacturing method and heat sink technology, applied in the manufacture of heat sinks and the field of heat sinks, can solve the problems of large volume and weight of the whole product, high heat generation, difficulty in promoting the miniaturization and lightweight design of high-power electronic products, and achieve Improve the convection and radiation cooling capacity, increase the cooling area, and realize the effect of miniaturization

Inactive Publication Date: 2011-05-25
LINQUAN AEROSPACE MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of technology, many electronic devices, especially high-power electronic devices, tend to be more and more miniaturized and lightweight. This kind of miniaturized and lightweight high-power electronic Large, it needs to load a large-volume radiator as its heat dissipation method, and requires a large weight as the heat sink of the equipment to store heat energy, resulting in a large volume and weight of the whole product
The existing heat sink design technology has been difficult to promote the miniaturization and lightweight design of high-power electronic products

Method used

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  • Method for manufacturing radiator and radiator
  • Method for manufacturing radiator and radiator
  • Method for manufacturing radiator and radiator

Examples

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Embodiment 1

[0016] Example 1. like figure 1 , 2 As shown, the composition includes a shell 1 and a cover plate 2, heat dissipation fins 3 are processed on the edge of the shell 1, polygonal or circular shapes are processed on the surface of the shell 1 without the cover plate and the panel of the cover plate 2 The heat dissipation guide post 4 of the housing 1 edge is connected with the heat dissipation guide post 4 on the edge of the housing 1 (such as image 3 As shown), a deep hole 5 is drilled in the center of each heat dissipation guide post 4. Where the edge of the housing 1 is connected to the cover plate 2 , the heat dissipation guide post 4 is connected to the heat dissipation fin 3 of the same height, and the protruding height thereof is equivalent to the required height of the cover plate 2 .

[0017] During manufacture, a number of polygonal or circular heat dissipation guide pillars 4 are processed on the shell 1 of the radiator. The number of heat dissipation guide pillar...

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Abstract

The invention discloses a method for manufacturing a radiator and the radiator. The method comprises the following steps of: processing polygonal or circular radiating guide posts on a shell of the radiator, simultaneously processing radiating fins on the edge of the shell, connecting the radiating fins and the radiating guide posts on the edge, and drilling deep holes in the centers of the radiating guide posts to enlarge the radiating surface area of the shell and lighten the weight of the shell; and processing polygonal or circular radiating guide posts on a cover plate of the radiator, and drilling deep holes in the centers of the radiating guide posts to enlarge the radiating surface area of the cover plate and lighten the weight of the cover plate. By skillfully combining the radiating fins and the radiating guide post and greatly enlarging the outer surface area of the radiator, the method improves the convection and heat radiation capabilities of the radiator at the same time of lightening the weight so as to greatly promote the radiating capability of the radiator and realize the miniaturization and lightweight design requirements of high-power electronic equipment products.

Description

technical field [0001] The invention relates to a method for manufacturing a radiator and a structure of the radiator. Background technique [0002] A traditional radiator includes a bottom plate in contact with electronic components and a number of cooling fins arranged on the bottom plate. The bottom plate is used to absorb the heat generated by the electronic components, and then dissipate the heat into the air through the cooling fins. With the development of technology, many electronic devices, especially high-power electronic devices, tend to be more and more miniaturized and lightweight. This kind of miniaturized and lightweight high-power electronic Large, it needs to load a large volume radiator as its heat dissipation method, and requires a large weight as the heat sink of the equipment to store heat energy, resulting in a large volume and weight of the whole product. The existing heat sink design technology has been difficult to promote the miniaturization and li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/26
Inventor 吴以华杨亚宁
Owner LINQUAN AEROSPACE MOTOR CO LTD
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