Method for manufacturing radiator and radiator

Abstract

The invention discloses a method for manufacturing a radiator and the radiator. The method comprises the following steps of: processing polygonal or circular radiating guide posts on a shell of the radiator, simultaneously processing radiating fins on the edge of the shell, connecting the radiating fins and the radiating guide posts on the edge, and drilling deep holes in the centers of the radiating guide posts to enlarge the radiating surface area of the shell and lighten the weight of the shell; and processing polygonal or circular radiating guide posts on a cover plate of the radiator, and drilling deep holes in the centers of the radiating guide posts to enlarge the radiating surface area of the cover plate and lighten the weight of the cover plate. By skillfully combining the radiating fins and the radiating guide post and greatly enlarging the outer surface area of the radiator, the method improves the convection and heat radiation capabilities of the radiator at the same time of lightening the weight so as to greatly promote the radiating capability of the radiator and realize the miniaturization and lightweight design requirements of high-power electronic equipment products.

Description

technical field [0001] The invention relates to a method for manufacturing a radiator and a structure of the radiator. Background technique [0002] A traditional radiator includes a bottom plate in contact with electronic components and a number of cooling fins arranged on the bottom plate. The bottom plate is used to absorb the heat generated by the electronic components, and then dissipate the heat into the air through the cooling fins. With the development of technology, many electronic devices, especially high-power electronic devices, tend to be more and more miniaturized and lightweight. This kind of miniaturized and lightweight high-power electronic Large, it needs to load a large volume radiator as its heat dissipation method, and requires a large weight as the heat sink of the equipment to store heat energy, resulting in a large volume and weight of the whole product. The existing heat sink design technology has been difficult to promote the miniaturization and li...

AI Technical Summary

Problems solved by technology

With the development of technology, many electronic devices, especially high-power electronic devices, tend to be more and more miniaturized and lightweight. This kind of miniaturized and lightweight high-power electronic Large, it needs to load a large-volume radiator as its heat dissipation method, and requires a large weight as the heat sink of the equipment to store heat energy, resulting in a large volume and weight of the whole product

The existing heat sink design technology has been difficult to promote the miniaturization and lightweight design of high-power electronic products

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