I/O (input/output) unit and integrated circuit chip

Abstract

The invention provides an I / O (input / output) unit and an integrated circuit chip. The I / O unit comprises an N-type electrostatic discharge protection circuit, a P-type electrostatic discharge protection circuit, a pad and an I / O logic circuit, wherein the N-type electrostatic discharge protection circuit and the P-type electrostatic discharge protection circuit are transversely adjacent; the pad covers part of the N-type electrostatic discharge protection circuit and part of the P-type electrostatic discharge protection circuit; the I / O logic circuit and a laminated structure formed by the pad, the N-type electrostatic discharge protection circuit and the P-type electrostatic discharge protection circuit are longitudinally adjacent; the N-type electrostatic discharge protection circuit isconnected with an earth wire; and the P-type electrostatic discharge protection circuit is connected with a power wire. The I / O unit and the integrated circuit chip have the following advantages: thearea of the I / O unit is smaller; correspondingly, a bigger area for placement and routing is provided to the core circuit region of the integrated circuit chip, thus reducing the difficulty of placement and routing of the core circuit region; and under the condition of a definite core circuit area, the integrated circuit chip comprising the I / O unit has a smaller area.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit design, in particular to an I / O unit and an integrated circuit chip. Background technique [0002] As the functions of semiconductor devices become increasingly complex and their sizes decrease, the upper limit of the electrostatic discharge (ESD, Electro Static Discharge) voltage that they can withstand is also decreasing. Therefore, in the design of semiconductor integrated circuits, various electrostatic discharge protection designs are often used to protect the semiconductor devices inside the integrated circuit chip. [0003] At present, a commonly used electrostatic discharge protection design is to integrate an electrostatic discharge protection circuit in an input / output (I / O) unit of an integrated circuit chip, and to solder the electrostatic discharge protection circuit to the corresponding I / O unit. Disk (PAD) connected. figure 1 It is a structural schematic diagram of ...

AI Technical Summary

Problems solved by technology

[0006] The invention solves the problem in the prior art that the area of ​​the I / O unit containing the electrostatic discharge protection circuit is relatively large, so that the layoutable area of ​​the core circuit area in the integrated circuit chip is small and the area of ​​the integrated circuit chip is large

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