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Reflow soldering apparatus

A technology of reflow soldering and reflow soldering furnace, which is used in auxiliary devices, welding equipment, metal processing and other directions, can solve the problems of temperature interference and soldering quality degradation, and achieves prevention of temperature interference, high-quality soldering, and improved efficiency. Effect

Active Publication Date: 2013-07-31
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the circuit board is placed on a plurality of transport paths and soldered, there is a problem that the quality of the soldering is degraded due to temperature disturbance between the transport paths and deviations in the temperature profile.
[0008] In addition, in the method described in Patent Document 1, it is assumed that the circuit board is placed on only one of the two conveyors, and it is not possible to place the circuit board on all the plurality of conveyors for soldering. method of situation
Therefore, when the circuit boards are placed on a plurality of conveyors and soldered, there is a problem that the quality of the soldering is degraded due to temperature disturbances and deviations in the temperature profile.
In addition, the need for a dummy circuit board that does not require soldering is also a problem

Method used

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Embodiment Construction

[0022] Next, embodiments of the present invention will be described. In addition, description will be made in the following order.

[0023] 1. First Embodiment

[0024] 2. Modification

[0025] In addition, one embodiment described below is a preferred specific example of the present invention. Although technically preferred various limitations are added, in the following description, only

[0026] The scope of the present invention shall not

[0027] It is not limited to these embodiments.

[0028] 1. First Embodiment

[0029] Structure of reflow soldering equipment

[0030] figure 1 It is a figure which shows the schematic structure of the reflow soldering apparatus 1 as an example of the soldering apparatus which concerns on one Embodiment of this invention. The reflow soldering device 1 includes: a reflow soldering furnace 2 , a first conveyor 3 , a second conveyor 4 , a shielding body 5 , and an outer plate 6 .

[0031] The reflow oven 2 is used, for example, ...

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PUM

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Abstract

The invention provides a reflow soldering apparatus which has a plurality of conveying paths and is capable of preventing temperature interference between conveying paths. A reflow soldering furnace (2) includes first and second conveyers (3, 4) for transporting a circuit board (W) into a conveying path (9), and first and second conveying paths. The first and second conveyers (3, 4) includes inner conveying belts (31, 41) which are arranged at the inner side of the reflow soldering furnace (2) and are perpendicular to the conveying direction, and outer conveying belts (32, 42) which are arranged at the outer side and are approximately parallel to the inner conveying belt (31). The inner conveying belt (31) includes an aluminum guide rail (31a) which is approximately parallel to the conveying direction and runs horizontally from an input end (7) to an output end (8) via the conveying path (9). A shield (5) for preventing temperature interference between the first and second conveying paths is arranged on the guide rail (31a).

Description

technical field [0001] The present invention relates to a reflow apparatus for reflowing printed circuit boards. Background technique [0002] A reflow soldering apparatus is used in which a solder composition is supplied to an electronic component or a printed circuit board in advance, and then the circuit board is conveyed by a conveyor in a reflow soldering furnace. The reflow soldering apparatus includes: a conveyor for conveying the circuit board; and a reflow oven main body for supplying the circuit board as an object to be heated by the conveyor. For example, the reflow furnace is divided into a plurality of areas along the conveyance path from the import port to the export port, and the plurality of areas are arranged in an in-line form. A plurality of zones have functions such as heating zones, cooling zones, etc. according to their functions. [0003] The heating zones respectively have an upper furnace body and a lower furnace body. For example, by blowing hot ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/00B23K3/08
Inventor 川上武彦田森信章
Owner TAMURA KK