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Sputtering device

A technology of sputtering and sputtering chamber, applied in the field of sputtering, which can solve the problems of unstable sputtering process, degradation of coating quality, and mutual contamination of targets, so as to avoid target poisoning, improve bonding force, and stabilize the sputtering process Effect

Inactive Publication Date: 2011-06-08
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when one of the targets is used, the target in use is likely to be sputtered onto the other target, causing mutual contamination between the targets and causing target poisoning, thus making the sputtering process unstable , the quality of the coating deteriorates

Method used

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Embodiment Construction

[0015] The sputtering device of the present technical solution will be further described in detail below with reference to the drawings and embodiments.

[0016] The sputtering device 100 provided in the first embodiment of the technical solution includes a sputtering chamber 10 , a sputtering transmission assembly 20 , a first target 31 and a second target 32 ​​. Wherein, the sputtering chamber 10 has a sputtering chamber 12 , and the sputtering transmission assembly 20 is arranged in the sputtering chamber 12 . The sputtering transmission assembly 20 is used for loading and transporting the workpiece 150 to be plated for sputtering. The first target material 31 and the second target material 32 are used as sputtering sources.

[0017] Specifically, see Figure 1-3 , the sputtering chamber 10 includes a top wall (not shown) and a bottom wall 102 opposite to each other, and a side wall 104 connecting the top wall and the bottom wall 102 . The sputtering chamber 12 is surrou...

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Abstract

The invention discloses a sputtering device which comprises a sputtering chamber, a sputtering transmission assembly, a first target and a second target, wherein the sputtering transmission assembly comprises a first driving gear, a second driving gear, a transmission rail, a transmission belt, a plurality of driven gears and a plurality of material rods. The first driving gear and the second driving gear are adjacently arranged. The transmission rail comprises a first rail surrounding the first driving gear and a second rail surrounding the second driving gear. The transmission belt is arranged on the transmission rail and can move relative to the transmission rail. The driven gears are sequentially arranged and axially fixed on the transmission belt; and each driven gear is used for transmission on the first rail and the second rail under the driving action of the first driving gear and the second driving gear. The material rods are respectively arranged on the driven gears. The first target is arranged at the arc center of the first rail and used for sputtering a first sputtered layer on the surface of a workpiece to be sputtered. The second target is arranged at the arc center of the second rail and used for sputtering a second sputtered layer on the surface of the workpiece to be sputtered.

Description

technical field [0001] The invention relates to sputtering technology, in particular to a sputtering device used for workpiece sputtering. Background technique [0002] With the rapid development of various electronic products, consumer groups have higher and higher requirements for electronic products, such as the appearance and color of electronic products, electromagnetic shielding functions, anti-oxidation and corrosion functions, and so on. Therefore, the sputtering treatment technology of each component of electronic products is becoming more and more important, and the quality of the coating directly affects the quality of the above-mentioned various properties of electronic products. [0003] Moreover, with the continuous improvement of the requirements for the quality of coatings, some important components need to be coated with two or more different coatings, so that electronic products have better performance. At present, when multi-layer coatings need to be sput...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/56
CPCH01J37/34C23C14/505C23C14/3464H01J37/32779
Inventor 王仲培
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD