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Lead-free solder containing Sn, Ag, Cu and Co

A lead-free solder, tin-silver-copper technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve problems such as circuit failure, improve stability, inhibit polarization, and improve soldering The effect of material performance

Inactive Publication Date: 2011-06-15
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After being energized for a period of time, the crack penetrates the solder joint at the negative electrode, causing an open circuit failure

Method used

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  • Lead-free solder containing Sn, Ag, Cu and Co
  • Lead-free solder containing Sn, Ag, Cu and Co
  • Lead-free solder containing Sn, Ag, Cu and Co

Examples

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Embodiment 1

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Abstract

The invention discloses a lead-free solder containing Sn, Ag, Cu and Co, and belongs to the field of new materials and new application of materials. The lead-free solder contains Co with the mass fraction of 0.05 to 1.0%, and the balance of Sn3.0Ag0.5Cu. The addition of Co can effectively suppress the growth of intermetallic compounds inside or on the interface of the solder joint, improve the stability of the joint microstructure to the temperature and the current density, and inhibit the polarization phenomenon and the occurrence of cavities. The lead-free solder containing Sn, Ag, Cu and Co can simultaneously improve the mechanical performance of the solder joint and inhibit the migration of the solder joint material, and is suitable for soldering materials for electronic products, in particular to the lead-free solder for surface package.

Description

A kind of tin-silver-copper-cobalt lead-free solder technical field The invention relates to a tin-silver-copper-cobalt lead-free solder, in particular to a tin-silver-copper-cobalt lead-free solder that can simultaneously improve the mechanical properties of solder joints and can inhibit the migration of solder joint substances under the condition of power on, which belongs to the new Materials and new areas of use of materials, suitable for solder joint link materials in electronics, especially lead-free solder alloys used in surface packaging. Background technique Lead-free solder should have good physical properties, thermal matching capabilities, mechanical properties, and environmental coordination. At present, SnAgCu (SAC) eutectic or near-eutectic alloy has become one of the substitutes for Sn-Pb solder. Among them, Sn-3.8Ag-0.7Cu (wt.%) recommended by the European Union, Sn-3.0Ag-0.5Cu recommended by JEITA in Japan, and Sn-3.9Ag-0.5 solder recommended by NEMI in ...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 郭福马立民徐广臣史耀武夏志东雷永平
Owner BEIJING UNIV OF TECH
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