Heat dissipation structure of high-definition vidicon

A high-definition camera and heat dissipation structure technology, applied in image communication, color TV parts, TV system parts, etc., can solve problems such as contact disconnection, CCD chip failure, and CCD chip heat cannot be dissipated in time, to achieve Stable work, avoid the effect of overheating

Inactive Publication Date: 2011-06-15
TIANJIN TIANDY DIGITAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the high-definition camera in the prior art, a high-definition CCD chip is used to convert the image into a video signal. Due to the high resolution of the video, the heat generated by the CCD chip is relatively large during operation, and the CCD chip is surrounded by the shell of the high-definition camera. The interior is separated from the external space, and the heat generated by the CCD chip cannot be dissipated in time, resulting in an excessively high

Method used

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  • Heat dissipation structure of high-definition vidicon
  • Heat dissipation structure of high-definition vidicon
  • Heat dissipation structure of high-definition vidicon

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Abstract

The invention provides a heat dissipation structure of a high-definition vidicon. The vidicon comprises a shell, a vidicon front panel, a CS adapter ring, a charge coupled device (CCD) chip, a CCD circuit board, an optical filter mounting plate, a vidicon mainboard, a vidicon rear panel and a CCD heating panel, wherein the CCD heating panel is of a metal strip structure; the CCD heating panel is inserted into a gap which is fixed between the CCD chip and the CCD circuit board; the back of the CCD chip is closely adhered to the CCD heating panel; and parts extending out of the two ends of the CCD heating panel are adhered to and contacted with the vidicon front panel respectively. Quantity of heat generated by the CCD chip in working can be directly conducted to the vidicon front panel by the CCD heating panel, and then the vidicon front panel performs heat exchange with the outside, so that the quantity of heat generated by the CCD chip can be dissipated outside the shell, thus avoiding the temperature of the CCD chip from being overhigh in the working, thereby ensuring that the high-definition vidicon can stably work in the long-term monitoring operation.

Description

Heat dissipation structure of HD camera technical field The invention relates to the technical field of monitoring cameras, in particular to a heat dissipation structure of a high-definition camera that transmits and radiates heat generated by a CCD chip to the outside in time through a CCD cooling plate, thereby ensuring the normal operation of the CCD chip. Background technique The high-definition camera mentioned in the monitoring field is a monitoring camera that has a high-resolution image acquisition and processing unit, and performs remote data transmission and sending of the collected image data through the network. Usually in the monitoring industry, the concept of high-definition cameras is divided into two types, one is analog high-definition cameras, and the other is digital high-definition cameras. The analog camera is limited by its own performance, and its resolution reaches D1 or 4CIF products (D1 resolution: PAL system 720×576, NTSC system 720×480; 4CIF r...

Claims

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Application Information

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IPC IPC(8): H04N5/225H05K7/20
Inventor 戴林张秋菊
Owner TIANJIN TIANDY DIGITAL TECH
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