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Double-layer splitter plate hot runner

A splitter plate and hot runner technology, which is applied in the field of improvement of splitter plates in hot runner injection molds, can solve the problems of difficulty in balancing the flow of plastic materials, difficulty in processing large splitter plates, and high processing costs of hot runners, and achieve favorable flow balance , simple processing, small size effect

Inactive Publication Date: 2011-06-29
HAIER GRP CORP +1
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Problems solved by technology

[0004] The invention provides a double-layer splitter plate hot runner, which can solve the problem of valve pin stuck caused by thermal expansion of the splitter plate in the prior art, large-scale splitter plate processing is difficult, hot runner processing cost is high, and the problem of multi-gate hot runners The flow of plastic material in the runner is difficult to balance and other problems

Method used

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  • Double-layer splitter plate hot runner
  • Double-layer splitter plate hot runner
  • Double-layer splitter plate hot runner

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Embodiment Construction

[0027] figure 1 Shown is the single-layer manifold hot runner mentioned in the previous background technology, including manifold a, main nozzle b, hot nozzle body c, and heating wire d. During the injection molding process, the heating wire d is heated to divert flow when forming large plastic products The length of the plate a is very large, so its thermal expansion is very large, which may easily cause the valve needle in the nozzle body c to be stuck at the nozzle. At the same time, due to the limitation of the processing technology, it is difficult to ensure the distribution of the nozzle body c The distance to each hot nozzle body c is equal, so the flow of molten material in the cavity is unbalanced, which affects the quality of the product; moreover, the processing of this complex manifold is difficult and requires large-scale equipment.

[0028] see Figure 2 to Figure 5 , the double-layer manifold hot runner of the present invention used for forming the above-mentio...

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Abstract

The invention provides a double-layer splitter plate hot runner, which can solve the problems of valve needle blocking caused by thermal expansion of a splitter plate, high machining difficulty of a large-sized splitter plate and the like existing in the prior art. The technical scheme is that: the double-layer splitter plate hot runner comprises splitter plates, a main injection molded nozzle and a valve needle, wherein the splitter plates comprise an upper splitter plate and at least one lower splitter plate; and a smelt runner in the upper splitter plate is communicated with a smelt runner in the lower splitter plate. The invention aims to transfer the expansion of the splitter plates in the hot runner to the upper splitter plate to avoid the valve needle blocking phenomenon caused by large size and large thermal expansion of the single-layer splitter plate when a large-sized plastic product is formed by a hot runner injection mould.

Description

technical field [0001] The invention relates to the technical field of hot runner injection molds, in particular to the improvement of the splitter plate in the hot runner injection mold. Background technique [0002] The hot runner is to keep the plastic in the runner and gate in a molten state by heating. Since there are heating rods and heating rings near or in the center of the runner, the entire runner from the nozzle outlet of the injection molding machine to the gate is in a high temperature state, which keeps the plastic in the runner molten. The emergence of hot runner technology is a revolution in injection molding technology. In principle, it is to keep the plastic of the pouring system of the mold in the molten state required for pouring, to achieve less and no waste production, reduce the material cost of injection molding production, and waste recycling. Take advantage of the cost. In the hot runner, the splitter plate plays a very important role. It is usual...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/17B29C45/26B29C45/27
Inventor 赵西金张平黄俊史允岭
Owner HAIER GRP CORP
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