Electronic paper unit, cutting device and manufacture method for electronic paper unit

A technology of cutting equipment and manufacturing method, which is applied in the field of electronic paper, can solve the problems that the glass substrate process cannot be fully applied, and achieve the effects of reducing water vapor intrusion into the electronic ink layer, increasing adhesion, and reducing the occurrence of air bubbles

Inactive Publication Date: 2011-06-29
AU OPTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, flexible substrates have many limitations of their own materials, so they cannot be fully applied to the current glass substrate technology

Method used

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  • Electronic paper unit, cutting device and manufacture method for electronic paper unit
  • Electronic paper unit, cutting device and manufacture method for electronic paper unit
  • Electronic paper unit, cutting device and manufacture method for electronic paper unit

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Embodiment Construction

[0045] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0046] figure 1 is a schematic diagram of an electronic paper unit according to an embodiment of the present invention. Please refer to figure 1 , in this embodiment, the electronic paper unit 100 may include a flexible substrate 110 , a thin film transistor layer 120 , an electronic ink layer 130 , an adhesive layer 140 , a waterproof layer 150 and a frame glue 160 . The flexible substrate 110 may be a film substrate made of polyimide. The thin film transistor layer 120 is disposed on the flexible substrate 110 . The electronic ink layer 130 is disposed on a surface S1 of the thin film transistor layer 120, wherein the electronic ink layer 130 and the thin film transistor layer 120 can be connected together by an adhesive layer 140, and the electronic ink layer 130 can be an electrophoretic (EP) The film is displayed, and...

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Abstract

The invention provides an electronic paper unit, a cutting device and a manufacture method for the electronic paper unit.The electronic paper unit comprises a flexible substrate, a thin film transistor layer, an electronic ink layer, a waterproof layer and a frame adhesive.The c is arranged on the flexible substrate.The electronic ink layer is arranged on the surface of the thin film transistor layer.The waterproof layer is arranged on the electronic ink layer.A sidewall is formed by the end face of the waterproof layer together with the end face of the electronic ink layer.A first acute angle or a first obtuse angle is formed between the sidewall and the surface.The frame adhesive is coated on the sidewall and the surface.Meanwhile, a cutting device and a manufacture method for the electronic paper unit are also provided.

Description

technical field [0001] The invention relates to an electronic paper, in particular to an electronic paper unit, a cutting device for cutting the electronic paper and a manufacturing method of the electronic paper unit. Background technique [0002] In recent years, electronic paper (E-paper) and electronic book (E-book) are booming, and displays with lighter, thinner, and flexible features will become the main development trend in the future. [0003] However, the flexible substrate has many material limitations, so it cannot be fully applied to the current glass substrate technology. Therefore, how to improve the existing equipment so that it can be applied to the production of flexible substrates has become a problem to be solved by relevant personnel. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide an electronic paper unit with better durability. [0005] Another technical problem to be solved by the present...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/167B23K26/36B23P17/00B26D9/00B23K26/38
Inventor 张展玮吴和虔彭佳添胡至仁
Owner AU OPTRONICS CORP
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