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Method for manufacturing module with built-in component, and module with built-in component

A manufacturing method and component technology, which are applied in the manufacture of component built-in modules and the field of component built-in modules, can solve problems such as lower fixing strength, warpage of substrates, different thermal expansion coefficients, etc., so as to reduce manufacturing costs and simplify manufacturing processes. Effect

Inactive Publication Date: 2014-03-05
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In this method, an adhesive tape is required to temporarily fix the circuit components, but since the adhesive tape is discarded after use, there is a problem that the manufacturing cost increases
In addition, it is necessary to apply adhesive in the gap between the circuit component and the through-hole of the core board, but the operation of applying the adhesive in a narrow space requires time and precision
In addition, since the adhesive and the resin layers laminated on both sides of the core board are generally made of different materials, the thermal expansion coefficients are different, and the board may warp due to temperature changes.
In order to suppress warping, it is preferable to apply the adhesive only to a part of the gap between the circuit component and the through hole, but in this case, since the fixing strength of the circuit component becomes low, the adhesive tape is removed from the When the core board is peeled off, the circuit components may come off from the through hole due to the adhesive force of the tape

Method used

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  • Method for manufacturing module with built-in component, and module with built-in component
  • Method for manufacturing module with built-in component, and module with built-in component
  • Method for manufacturing module with built-in component, and module with built-in component

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Embodiment approach 1

[0026] refer to figure 1 , Embodiment 1 of the component built-in module according to the present invention will be described.

[0027] exist figure 1Among them, the component built-in module A of the present embodiment is composed of a core board 1 , a first resin layer 10 laminated on the lower side of the core board 1 , and a second resin layer 20 laminated on the upper side of the core board 1 . The core board 1 may be a ceramic substrate such as LTCC other than a printed wiring board such as a resin substrate. Here, although the core board 1 shows an example of a multi-layer substrate, it may also be a single-layer substrate. The first resin layer 10 is a resin layer thinner than the core board 1, and thermosetting resins such as epoxy resins, materials containing inorganic fillers and thermosetting resins, and prepregs can be used. The second resin layer 20 is desirably made of the same material as the first resin layer 10, but may be made of other materials.

[0028...

Embodiment approach 2

[0046] Figure 4 Embodiment 2 of the component built-in module is shown. In the component built-in module B of this embodiment, the resin layer 30 is further combined and laminated|stacked on the lower surface of the 1st resin layer 10 of the component built-in module A of Embodiment 1. As shown in FIG. The resin layer 30 is a thin resin layer similar to the first resin layer 10, and in-plane conductors connected to the in-plane conductors 12a and 12b of the first resin layer 10 via a plurality of interlayer connecting conductors 31 are formed on the lower surface thereof. 32. In addition, of course, a resin layer may be further laminated on the lower surface of the resin layer 30 .

Embodiment approach 3

[0048] Figure 5 Embodiment 3 of the component built-in module is shown. In order to increase the mounting density, the module C with built-in components of this embodiment mounts the third circuit components 40 on the in-plane conductors 12a, 12b on the back surface of the first resin layer 10, and laminates them on the back surface of the first resin layer 10. The third resin layer 50 , so that the third circuit component 40 is buried in the third resin layer 50 . The third circuit component 40 may be a lower component than the first circuit component 3 . The third resin layer 50 can use the same material as the first and second resin layers 10 and 20 . A plurality of interlayer connection conductors 21 connected to the in-plane conductor pattern 4 of the core board 1 are formed in the second resin layer 20, and a plurality of interlayer connection conductors 21 connected to the interlayer connection conductors 21 are formed on the surface of the second resin layer 20. In...

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Abstract

Provided are a method for manufacturing a module with a built-in component, which can be easily manufactured without using a tape and adhesive, and the module with the built-in component. A core substrate (1) having an opening section (2) is laminated on a first resin layer (10) in an uncured state, and a first circuit component (3) is adhered on a part from which a first resin layer in the opening section is exposed.  Then, a second resin layer (20) in an uncured state is laminated on the core substrate (1), a second resin layer is applied in a gap between an inner wall of the opening section (2) and a first circuit component (3), then, the first resin layer (10) and the second resin layer (20) are cured.

Description

technical field [0001] The invention relates to a manufacturing method of a component built-in module and a component built-in module. The component built-in module in the present invention refers to a module in which a core board is placed in the middle, resin layers are provided on the front and back sides, and at least one circuit component is built between the two resin layers. Components may be embedded in each resin layer. In addition, a resin layer may be further laminated on the front and back resin layers. Background technique [0002] In recent years, along with the miniaturization of electronic equipment, circuit boards on which circuit components such as chip capacitors are mounted have been required to be miniaturized. Accordingly, by manufacturing a module by embedding circuit components inside the circuit board, the mounting area of ​​the circuit components is reduced, and miniaturization of the circuit board is attempted. Among them, a component-embedded s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH01L2924/01074H01L2924/09701H05K3/4652H01L2924/01005H05K3/284H05K1/183H05K2203/063H05K3/4069H01L24/24H05K3/4614H01L2924/01029H05K3/4644H01L2224/16225H01L2224/24227H01L2924/01004H05K3/4697H01L2924/01006H01L2924/01033H05K3/4602H01L2224/04105H01L2924/14H01L2924/15156H01L2924/15313H01L2924/15787H01L2924/19105H01L2924/19106H01L2924/00
Inventor 野村雅人
Owner MURATA MFG CO LTD