LED light source module

Abstract

The invention relates to a semiconductor illumination technology, in particular to an LED light source module which comprises a metal substrate, wherein the front side of the metal substrate is provided with an LED bulb, and the LED bulb is connected to the metal substrate through a base. The LED light source module also comprises a lens, wherein the light incoming side of the lens is provided with a pit defined by hems; the lens is buckled on the LED bulb and the base; the LED bulb and the base are sunk in the pit; and the hems enclose the base. The LED light source module also comprises a section bar, wherein the section bar comprises a cavity, and the top surface of the section bar is provided with a hole; the metal substrate is arranged in the cavity; and the lens is protruded out of the top surface of the section bar through the hole. The LED light source module has a simple structure and high heat radiating efficiency.

Description

technical field [0001] The invention relates to semiconductor lighting technology, in particular to an LED light source module. Background technique [0002] Semiconductor lighting technology has become the mainstream of the light source market because of its energy saving and long service life. [0003] LED light source modules basically include a metal substrate to enhance the heat conduction effect. The LED luminous body is arranged on the front surface of the metal substrate, and the heat dissipation component is pasted on the back surface of the metal substrate. [0004] For example, the Chinese patent document CN101625081A discloses an LED light source module on January 13, 2010. The LED light source module includes an LED light emitting module and a module base. The LED light source module also includes an optical cover plate, and the optical cover plate It is fixed on the module base and defines a closed space with the module base, and the LED light-emitting module...

AI Technical Summary

Problems solved by technology

[0006] Like the aforementioned prior art, the LED light sources on the market all have the disadvantages of complex structure and high assembly cost.

[0007] On the other hand, the heat transfer path of the prior art also determines the limitation of its heat dissipation effect. Like the aforementioned patent documents, in the prior art, the heat generated when the LED is in operation is transferred from the front of the metal substrate to the metal substrate. It is transmitted from the back of the metal substrate to the heat dissipation component, and the length of the heat transfer path determines the limitation of the improvement of the heat dissipation effect.

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