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Semiconductor packaging process and die utilized in same

A packaging process and semiconductor technology, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and electrical solid-state devices, and can solve problems such as reducing yield and increasing efficiency and cost.

Active Publication Date: 2011-07-20
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, before clamping the other half of the finished product, the mold 1 must be cleaned first, thereby reducing efficiency and increasing costs, otherwise, the adhesive 22 will stick to the other half of the finished product, thereby reducing the yield

Method used

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  • Semiconductor packaging process and die utilized in same
  • Semiconductor packaging process and die utilized in same
  • Semiconductor packaging process and die utilized in same

Examples

Experimental program
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Embodiment Construction

[0012] refer to Figure 3 to Figure 5 , showing a schematic diagram of the semiconductor packaging process of the present invention. refer to image 3 , provide a half finished product 3 and a mold 4 . The semi-finished product 3 includes a carrier 31 , an adhesive 32 , a semiconductor substrate 33 and at least one semiconductor component 34 , and the carrier 31 has a first outer peripheral surface 311 . The semiconductor substrate 33 is a wafer or an interposer, which has a second peripheral surface 331 , and is adhered to the carrier 31 by the adhesive 32 , so that the carrier 31 serves as a support for the semiconductor substrate 33 . The semiconductor component 34 is disposed on the semiconductor substrate 33 . The mold 4 includes an upper mold 41 and a lower mold 42, the upper mold 41 has a pressing portion 411, the pressing portion 411 has a pressing surface 412, at least one mold cavity 413 and a third outer peripheral surface 414, the The mold cavity 413 is opened ...

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Abstract

The invention relates to a semiconductor packaging process and a die utilized in same. The die is used for clamping a semi-finished product and comprises an upper die and a lower die. The upper die comprises a first base and a pressing part, wherein the pressing part is protruded on the first base and comprises a pressing surface and at least one die cavity. The lower die comprises a second base and a bearing part, wherein the bearing part is protrusive on the second base and comprises a bearing surface. Therefore, when the semiconductor packaging process is performed, viscose in the semi-finished product can be prevented from being sticked to the die, thereby improving the yield, improving the efficiency and reducing the cost.

Description

technical field [0001] The present invention relates to a semiconductor packaging process and a mold used in the semiconductor packaging process, in detail, to a semiconductor packaging process that avoids sticking of glue and a mold used in the semiconductor packaging process. Background technique [0002] refer to figure 1 , shows a schematic cross-sectional view of a known die used in semiconductor packaging processes. The known mold 1 used in the semiconductor packaging process is used to hold a semi-finished product 2 and includes an upper mold 11 and a lower mold 12 . The upper mold 11 has a pressing surface 111 and at least one mold cavity 112 , and the mold cavity 112 is opened on the pressing surface 111 . The lower mold 12 has a bearing surface 121 . The semi-finished product 2 includes a carrier 21 , an adhesive 22 , a semiconductor substrate 23 and at least one chip 24 . The carrier 21 has a first peripheral surface 211 , the semiconductor substrate 23 has a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56
CPCH01L2224/48091H01L2224/48227H01L2924/181H01L2924/00014H01L2924/00012
Inventor 彭胜扬
Owner ADVANCED SEMICON ENG INC
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