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Method and device for packaging LED chip

An LED chip and LED packaging technology, applied in the direction of electric solid devices, semiconductor devices, electrical components, etc., can solve the problems of the influence of lens injection, the deformation of lens surface contour, and the residual stress of the lens, etc., to achieve low cost and solve complex process problems. Effect

Inactive Publication Date: 2011-07-20
CHINA COTRUN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The light-emitting molding control is a very complicated process, and the properties of the lens material itself are also different according to the variation of the molding parameters, which will have a great impact on the shooting of the lens, and the shrinkage of the lens will also be affected by the selection of materials and the setting of molding parameters. The difference will cause the surface profile of the lens to be deformed or the residual stress inside the lens will be too much, which will affect its optical effect.
The lenses in the prior art are generally made of light-transmitting plastics, glass, epoxy resin and other materials, which cannot meet the high temperature requirements of the lead-free solder process.

Method used

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  • Method and device for packaging LED chip
  • Method and device for packaging LED chip
  • Method and device for packaging LED chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] figure 1 For the schematic diagram of the LED packaging device of the embodiment of the present invention, please refer to figure 1 , it can be known that the LED packaging device in the embodiment of the present invention includes: a wafer 11 , a bump 12 , a lens 13 , an LED chip 14 , solder balls 15 and a conductive layer 16 . Wherein the LED chip 14 is used to generate light when an electric current is applied, and the wafer 11 is used as the substrate of the LED chip 14. The substrate used as the LED chip substrate is not limited to the wafer, and PCB boards, BT boards, glass plates, A ceramic plate or a plastic plate is used as the substrate, and the lens 13 is formed by curing the encapsulation material for encapsulating the LED chip 14. The protrusion 12 grows on the wafer 11 around the molding area of ​​the lens 13, and is used as a blocking device for the encapsulation material during the encapsulation process. , to define the molding area of ​​the lens 13, th...

Embodiment L

[0050] The manufacturing process of the LED packaging device in the embodiment of the present invention is introduced in detail below, please refer to Figure 7 , Figure 7 It is a flowchart of another embodiment of the present invention LED encapsulation method:

[0051] S11 , fabricate an insulating layer (not shown in the figure) on the wafer 11 , deposit a conductive layer 16 on the insulating layer, and form bump solder balls 15 on the conductive layer 16 and the blue light chip 14 . Wherein, the substrate is not limited to a wafer, and a PCB board, a BT board, a glass board, a ceramic board or a plastic board can also be used as a substrate, and the material of the conductive layer 16 is selected from aluminum, silver, copper, platinum, etc., which have high reflectivity to light. Nickel or its alloy material, the material of the solder ball 15 can be a single material such as gold, copper, tin, multi-layer material, alloy or non-all-metal material.

[0052] S12, growi...

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PUM

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Abstract

The invention discloses a method and a device for packaging a light emitting diode (LED) chip. The method comprises the following steps of: growing lug bosses surrounding a lens molding area on a substrate, and arranging the LED chip on the substrate, wherein the LED chip is positioned in the lens molding area defined by the lug bosses; and injecting a fluidic packaging material in a set dose into the top of the LED chip, and curing to form a lens for packaging the LED chip. Due to the technical scheme, the invention provides a method and a device for packaging the LED chip which can realize the packaging without an extra mold and adapt to LED wafer-level packaging.

Description

technical field [0001] The invention relates to the technical field of light emitting devices, in particular to a method for packaging LED chips and a packaging device. Background technique [0002] With the continuous growth of LED light-emitting diode market demand and the emergence of new applications, higher requirements are put forward for LED packaging technology. LED packaging plays a great role in improving LED performance and reducing costs. [0003] At present, there are mainly two types of LED packaging: single-chip and multi-chip integration. In a single-chip LED packaging device, the LED chip is flip-chip bonded on a transition substrate, and a metal circuit for electrical connection between the LED and the transition substrate is fabricated on the transition substrate. The transition substrate and the bonded LED The chip is connected to a heat sink. Then a prefabricated lens (formed by solidification of packaging material) covers the LED chip, circuit and tra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/50H01L33/56H01L33/58H01L25/075
CPCH01L2224/16225
Inventor 金鹏吴娜
Owner CHINA COTRUN TECH