Tensile spring structure for preparing diamond film

Abstract

The invention discloses a tensile spring structure for preparing a diamond film, which overcomes the defects that the tensity of all heating wires can not be adjusted independently and the heating wires are vibrated due to current fluctuation in the prior art. The invention provides a device which can automatically and finely adjust the tensity of all the heating wires independently. The device comprises a left insulating board, a right insulating board, a left electrode and a right electrode, wherein the left insulating board and the right insulating board are arranged on a base, the left electrode and the right electrode are made of molybdenum bars, a heating wire device is arranged between the two insulating boards and comprises a group of heating wires arranged in a multi-turning way and in the shape like a Chinese character zhi, left turning parts and right turning parts of the heating wires are hooked on a group of left elastic hooks and a group of right elastic hooks connected with the left insulating board or the right insulating board, each hook is provided with a guiding and limiting structure, and all the turning parts of the heating wires are electrically connected with one of the left electrode and the right electrode made of molybdenum bars through hooked electrodes. The tensile spring structure can adjust the tensity of the heating wires automatically, independently and finely, can ensure that all the sections of the heating wires do not droop and are positioned in the same plane in the whole growing process of diamond, enables the tensile force to be uniform and the tensity to be compensated automatically in the whole process.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a diamond film preparation device. Background technique [0002] Diamond formed by strong chemical bonding has special mechanical and elastic properties. The hardness, density, thermal conductivity, sound velocity, and elastic modulus of diamond are the highest among known materials, and its compressibility is the lowest among all materials. The Young's modulus of diamond is the lowest among all materials; the kinetic friction coefficient of diamond is only 0.05, which is also the lowest among all important materials; the dielectric loss phase angle of diamond is the lowest among all materials. Because diamond has excellent thermal, optical, acoustic, and electrical properties, it has a wide range of application prospects, but natural diamond reserves are scarce and expensive, which limits the development and application of diamond materials. The preparation of dia...

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to overcome the deficiency that the prior art cannot easily, independently and finely adjust the tension of each heating wire, and provide a device that can automatically independently and finely adjust the tension of each heating wire. This device can ensure that each segment of hot wire is evenly tensioned during the entire growth process of the diamond and will not sag and be on the same plane

Images