Two-sided lead frame structure

A lead frame, bilateral technology, used in semiconductor devices, semiconductor/solid-state device components, electrical components, etc., can solve the problem that the profit is not as good as expected, the adjustment space of product manufacturing cost is limited, material cost control, and manufacturing yield is not easy to improve and other problems, to achieve the effect of improving process yield and production profit, increasing process capacity and reducing material cost

Inactive Publication Date: 2013-04-10
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the influence of product-related design and process factors, it is not easy to improve the material cost control and manufacturing yield of the product. As a result, the adjustment space of the product manufacturing cost is very limited, and the profit obtained is not as ideal as expected.

Method used

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  • Two-sided lead frame structure

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Embodiment Construction

[0010] Please refer to Figure 1A to Figure 1C , Figure 1A is a schematic diagram of a double-sided lead frame structure according to a preferred embodiment of the present invention, Figure 1B , Figure 1C yes Figure 1A Partial enlarged view of the bilateral leadframe structure. Such as Figure 1A As shown, the bilateral lead frame structure 10 includes a first connecting rod 110 , a second connecting rod 120 , a plurality of first lead frames 130 and a plurality of second lead frames 140 . The first connecting rod 110 and the second connecting rod 120 are arranged parallel to each other, wherein the first connecting rod 110 is used for connecting the first lead frame 130 , and the second connecting rod 120 is used for connecting the second lead frame 140 . The bilateral lead frame structure 10 further includes a plurality of first support columns 150 and a plurality of second support columns 160, wherein the first support columns 150 and the second support columns 160 ar...

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Abstract

The invention discloses a two-sided lead frame structure. The two-sided lead frame structure comprises a first connecting rod and a second connecting rod which are parallel to each other, a plurality of first lead frames, a plurality of second lead frames, a plurality of first supporting columns and a plurality of second supporting columns, wherein the first lead frames are provided with a first bearing seat and two first lead pins respectively; the first bearing seats are arranged outside the first connecting rod; the first lead pins are arranged between the first connecting rod and the second connecting rod; the second lead frames are provided with a second bearing seat and two second lead pins respectively; the second bearing seats are arranged outside the second connecting rod; the second lead pins are arranged between the first connecting rod and the second connecting rod; the first supporting columns and the first bearing seats are arranged on a same side of the first connectingrod; the first supporting columns are longer than the first bearing seats; the second supporting columns and the second bearing seats are arranged on the same side of the second connecting rod; and the second supporting columns are longer than the second bearing seats.

Description

technical field [0001] The present invention relates to a lead frame structure, and in particular to a double-sided lead frame structure. Background technique [0002] Today's electronics industry is in an era of thin profits. Manufacturers who are able to control costs more can make profits with limited resources. However, in order to maintain a certain profit when the price of products continues to decline, the only way to reduce material costs and improve processes capacity, in order to maintain a certain level of production margins. [0003] However, affected by product-related design and process factors, it is not easy to improve the material cost control and manufacturing yield of the product. In turn, the adjustment space for product manufacturing cost is very limited, and the profit obtained is not as ideal as expected. Therefore, how to start from the product itself or its process to reduce the production cost is actually the primary problem to be solved by various...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495
CPCH01L2924/0002
Inventor 庄建德徐志宏
Owner EVERLIGHT ELECTRONICS
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