Electronic apparatus

Abstract

This invention provides one electron device, which comprises one first baseboard, one base frequency parts, one radio module and at least one first connection parts, wherein, the base parts are connected to first baseboard and the radio module is connected to the first baseboard through first connection parts.

Description

technical field [0001] The present invention relates to an electronic device, and in particular to an electronic device with a small volume and a high component arrangement density. Background technique [0002] In order to cope with the trend of electronic products being light, thin, small, high-frequency, modularized and multi-functional, electronic components are required to be relatively improved in terms of integration and integration. Therefore, high-frequency broadband materials and component technology in the new century will be the key to future technology. Through the breakthrough of new packaging (package) materials, the development of new manufacturing processes and the integration of design technologies, the level of system in package (SIP) has been reached. In addition, further develop high-frequency chip components, integrated passive devices (integrated passive devices, IPDs), micro-electro-mechanical systems (micro-electro-mechanical systems, MEMS) and nano...

AI Technical Summary

Problems solved by technology

[0004] However, since the baseband component 120 , the passive component 130 and the RF component 140 disposed on the substrate 110 by surface mount technology require a large connection area, the cost of the USB port 160 is relatively expensive and requires It is driven by a low voltage with fixed specifications, and these passive components 130 must be separately arranged on the substrate 110 so that its manufacturing process is relatively complicated, so it is known that the electronic device 100 needs to be improved.

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