157results about How to "Reduce the bonding area" patented technology

In anodic bonding between a conductor or semiconductor and glass, in order to attain good adhesion at a lower bonding temperature than usual and improve the toughness at its boundary to obtain higher reliability for a bonded portion even in a case where bonded members are warped or dust is present at the bonding boundary, a soft metal film is formed on the surface of a conductor or semiconductor on which an active metal film having high reactivity with oxygen is formed, whereby a warp or dust, if any, can be absorbed by the deformation of the soft metal film, thereby to improve the adhesion at the boundary. Adhesion at the bonding boundary is improved even at a low bonding temperature of, e.g., about 200° C. Further, the toughness at the bonding boundary can be improved to increase reliability by roughening the bonded surface on the side of the glass.

A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.

A device has a semiconductor chip, a wiring board, a support which supports the semiconductor chip on the wiring board and forms a gap between the semiconductor chip and the wiring board, and a sealing resin injected into the gap and covering the semiconductor chip.

A micro-element package module which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package module. The micro-element package module includes: an element substrate having a micro-element on a top surface of the element substrate; a circuit substrate that is provided around the element substrate; and an element housing that is provided above the element substrate and the circuit substrate, and includes a connecting section for electrically connecting the micro-element and the circuit substrate.

A manufacturing method for a semiconductor light emitting device is provided. The method includes preparing a first wafer in which at least one semiconductor layer including the emitter layer is formed; disposing a second wafer transparent to an emission wavelength of the emitter layer on the surface of the first wafer; providing a bonding failure prevention structure to at least either the first wafer or the second wafer for preventing bonding failures of the first wafer and the second wafer; and applying compressive force to a contact face between the first wafer and the second wafer while at the same time, heating the contact face. The first and second wafers can be bonded across their entire surfaces without causing bonding failure.

A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Provided is a breathable waterproof fabric including: a fabric substrate; a surface modified layer formed on a bonding surface of the fabric substrate; a dot adhesive member transferred to the surface modified layer; and a membrane bonded to the fabric substrate by the dot adhesive member.

The invention discloses a silicon-silicon-bonding-based pressure sensor capable of isolating a packaging stress. The pressure sensor includes a chip layer and a support layer. A lug used for silicon-silicon bonding is etched on the surface of the support layer. Gaps exist between other areas of the support layer and the chip layer. The structure is capable of avoiding too much consideration of material selection (such as a packing substrate of low stress and an adhesive of low stress) so that high-efficiency thermal isolation is realized comparatively easily and larger shock can be resisted and thus the pressure sensor is wider in application occasions.

For manufacturing a high-pressure discharge lamp, a tungsten electrode is welded to a molybdenum foil by bringing a shaft of tungsten electrode into close contact with the molybdenum foil, and by irradiating a laser light, having a metal melting wavelength, to a junction of the molybdenum foil with the tungsten electrode from a location closer to the molybdenum foil to melt both the molybdenum foil and the shaft of the tungsten electrode for bonding.

A functional dressing (film) comprises an edge remaining film 1 and a fixed pasting film 2 which are convenient to separate from each other, wherein a functional pad 3 is arranged between the edge remaining film 1 and the fixed pasting film 2, a protective film 4 is arranged on the face, with the back towards the functional pad, of the fixed pasting film, and a plurality of layers of annular adhesive tape or adhesive tape shaped like a Chinese character 'hui' is arranged on the fixed pasting film. Thus, on the one hand, the binding area of the fixed pasting film and the skin is reduced, and on the other hand, sweat can volatilize through reserved gap; due to the fact that a functional layer and a moisture-preserving layer are arranged in the functional pad, medicine ingredients in the functional layer and the moisture-preserving layer act on wounds and peripheral tissue, and the functional dressing (film) has the functions of stopping bleeding, resisting and preventing bacteria, diminishing inflammation, easing pain, promoting healing, reducing scar formation and accelerating local blood circulation.

An angular velocity detector includes an angular velocity detecting element having a vibrating body arranged in a base substrate to be vibrated on a surface horizontal with respect to the base substrate. The angular velocity detecting element detects an angular velocity around an axis perpendicular to the base substrate based on a vibration of the vibrating body. In the angular velocity detector, a circuit substrate is bonded to a first surface of the base substrate through an adhesive, and a second surface of the angular velocity detecting element is electrically connected to the circuit substrate through a bonding wire. Furthermore, the adhesive is partially arranged on the first surface of the base substrate at least at a portion corresponding to a bonding portion of the bonding wire on the second surface of the base substrate. Therefore, a wire bonding can be easily accurately performed.

The sensitive structure of the electrostatic force rebalanced pendulum silicon micro accelerometer is the upper and lower glass plates, and the middle is the sensitive mass block of the monocrystalline silicon pendulum structure. The three are connected together by bonding. The double flexible beams of the crystalline silicon sensitive mass are arranged opposite to the lead-out lines of the electrodes. In addition, in order to further reduce the influence of temperature on the monocrystalline silicon pendulum plate, the bonding area is reduced in the design, instead of the overall bonding, three small pieces of bonding are used to ensure that the bonding area of ​​the upper and lower glass plates is completely Consistent, and further reduce the temperature coefficient caused by thermal stress; the manufacturing method of the above-mentioned sensitive structure includes the manufacturing of single crystal silicon pendulum plate and the manufacturing of upper and lower glass cover plates. The invention can reduce the temperature coefficient of the instrument and improve the temperature repeatability, thereby improving the resolution and sensitivity of the silicon micro accelerometer and meeting the requirements of inertial guidance systems such as missiles.

Disclosed is a manufacturing method of a customized tongue-side invisible aligner, and belongs to the technical field of orthodontic treatment. The manufacturing method comprises steps of: performing three-dimensional scanning of a patient's teeth via laser to obtain image information; performing simulative alignment of teeth on a computer to obtain an ideal tooth alignment effect, and determining a tooth model scheme; printing the tooth model scheme of simulative alignment by using a 3D printer; designing three-dimensional models of an aligning bracket, a bracket baseplate, and an aligning steel wire, which are special for each tooth, by computer aided design and manufacturing technology. The manufacturing method is characterized by further comprising: carving the aligning bracket by adopting stainless steel via a numerically-controlled machine tool; selecting a stainless steel board, and carving a shape, identical to the teeth, at the lower surface of the stainless steel board via the numerically-controlled machine tool; and selecting a stainless steel mesh and welding the stainless steel mesh to the lower surface of the stainless steel board. According to the manufacturing method, an integrate bracket is manufactured by directly adopting three-dimensional image information, so that the bracket is high in precision and good in comfort during an orthodontic treatment process.

Disclosed herein are an adhesive sheet comprising a cured acrylic polymer, hollow polymeric microspheres dispersed and ruptured in the cured acrylic polymer, and hollow parts formed by rupturing the hollow polymeric microspheres dispersed in the cured acrylic polymer, and a preparation method thereof.

Disclosed herein is a power module package. The power module package includes a substrate having one surface formed with a circuit pattern including a chip mounting pad and an external connection pad and the other surface; a semiconductor chip mounted on the chip mounting pad; and an external connection terminal having one terminal and the other terminal, the one terminal being connected to the external connection pad and the other terminal protruding to the outside, in which the external connection pad and the external connection terminal are bonded to each other by welding.

A semiconductor device (100) includes: a substrate (102); a bonding pad (110) provided above the substrate (102); and an inductor (112) provided above the substrate (102) and below the bonding pad (110) for carrying out signal transmission/reception to/from the external in a non-contact manner by electromagnetic induction.

The invention provides a punching knife mold of a touch screen protecting film and a fitting process of the touch screen protecting film. The punching knife mold is characterized in that a knife point consists of an outer-layer knife point and an inner-layer knife point, wherein the outer-layer knife point and the inner-layer knife point are annular, and punching edges of the outer-layer knife point and the inner-layer knife point are located in the same plane; the inner-layer knife point is arranged in the outer-layer knife point, and a gap is formed between the outer-layer knife point and the inner-layer knife point. The punching knife mold is designed in a double-layer annular knife point structure can be used for annularly cutting the protecting film, and a punched annular glue layer exposed outside only needs to fit an peripheral region outside a visible region of a touch screen, so that the fitting process can be simplified, and the rate of finished products is beneficially guaranteed.

A method of producing a piezoelectric/electrostrictive device having a base including a pair of movable parts opposing each other, a fixing part that connects the movable parts with each other at one end thereof, and mounting parts that extend for a predetermined length while holding slit-shaped gaps of a predetermined width along inside surfaces of said movable parts by being turned around at the other end of said movable parts, said piezoelectric/electrostrictive device having a piezoelectric/electrostrictive element disposed on at least one outside surface of said movable parts of said base, wherein a base block obtained by laminating and calcining a large number of ceramic green sheets is adopted as a material for forming said base, and the base including said movable parts, said fixing part, and said mounting parts is formed by cutting said base block at a predetermined site along a lamination direction of said ceramic green sheets.

The invention relates to a transfer method for glueing spunbonded nonwovens. Spunbonded nonwovens and a ventilated membrane are placed at two uncoiling machines respectively and are rotating simultaneously for uncoiling. A transfer gluing system comprises a transfer embossing roll, a scraper and pressure rollers; the transfer embossing roll is an engraving roll with a plurality of pits engraved on a roll surface, and a lower part of the transfer embossing roll immerses into a glue tank and rotates continuously; the scraper is a device parallel to the transfer embossing roll and arranged behind the transfer embossing roll to scrape superfluous glue on the transfer embossing roll surface. The transfer embossing roll with scraped surface is closely bonded with the ventilated membrane; under stitching effect of the pressure roller above the transfer embossing roll, glue in the pits of the transfer embossing roll transfers to a surface of the ventilated membrane. The ventilated membrane with glue and the spunbonded nonwovens are stitched by a pressure roller above a drying cylinder and attached on a drying cylinder surface. The glue is solidified during the period, and solidified gluedspunbonded nonwovens are rolled by a winder.