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Electrostatic Force Rebalance Pendulum Silicon Micro Accelerometer Sensitive Structure and Manufacturing Method

An accelerometer and sensitive structure technology, applied in the direction of measuring acceleration, velocity/acceleration/impact measurement, measuring devices, etc., can solve the problem that the three-layer microstructure manufacturing process cannot be completely symmetrical, the influence of the symmetry of the upper and lower gaps, and the temperature characteristics of the instrument Poor and other problems, to improve the zero drift problem, reduce process costs, reduce the effect of internal stress

Active Publication Date: 2005-09-21
BEIJING AEROSPACE TIMES OPTICAL ELECTRONICS TECH
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Although the temperature coefficient ratio and temperature repeatability of this sensitive structure have been greatly improved, the manufacturing process of the three-layer microstructure cannot be completely symmetrical. This asymmetry still brings the temperature coefficient when the ambient temperature changes relatively When it is large, there is deformation, which leads to poor temperature characteristics of the instrument and poor temperature repeatability
[0006] In addition, the silicon pendulum is etched from top to bottom at the same time, which requires double-sided engraving. Many processes have strict requirements and there are errors
As the corrosion progresses, the concentration of the corrosion solution changes, which makes the corrosion rate unstable and the symmetry of the upper and lower gaps is affected.

Method used

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  • Electrostatic Force Rebalance Pendulum Silicon Micro Accelerometer Sensitive Structure and Manufacturing Method
  • Electrostatic Force Rebalance Pendulum Silicon Micro Accelerometer Sensitive Structure and Manufacturing Method
  • Electrostatic Force Rebalance Pendulum Silicon Micro Accelerometer Sensitive Structure and Manufacturing Method

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Embodiment Construction

[0043] Such as Image 6 As shown, the structure of the present invention is that the upper and lower glass pole plates 1, 2, the middle is a sensitive mass 3 of monocrystalline silicon pendulum structure, and the three are connected together by bonding to support the sensitive mass of monocrystalline silicon. The double flexible beams 4 are arranged opposite to the electrode lead wires 5 .

[0044] In order to further confirm the effect of the present invention, the prior art is compared with the present invention here.

[0045] In the prior art, the microstructure of the silicon micro-accelerometer has a large deformation when the ambient temperature changes greatly, resulting in poor temperature characteristics of the instrument, which is characterized by a large temperature coefficient of 0.5mg / °C and poor temperature repeatability. Due to the asymmetry of the three-layer structure of the silicon micro accelerometer head, the temperature coefficient is brought, such as i...

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Abstract

The sensitive structure of the electrostatic force rebalanced pendulum silicon micro accelerometer is the upper and lower glass plates, and the middle is the sensitive mass block of the monocrystalline silicon pendulum structure. The three are connected together by bonding. The double flexible beams of the crystalline silicon sensitive mass are arranged opposite to the lead-out lines of the electrodes. In addition, in order to further reduce the influence of temperature on the monocrystalline silicon pendulum plate, the bonding area is reduced in the design, instead of the overall bonding, three small pieces of bonding are used to ensure that the bonding area of ​​the upper and lower glass plates is completely Consistent, and further reduce the temperature coefficient caused by thermal stress; the manufacturing method of the above-mentioned sensitive structure includes the manufacturing of single crystal silicon pendulum plate and the manufacturing of upper and lower glass cover plates. The invention can reduce the temperature coefficient of the instrument and improve the temperature repeatability, thereby improving the resolution and sensitivity of the silicon micro accelerometer and meeting the requirements of inertial guidance systems such as missiles.

Description

Technical field [0001] The invention relates to a sensitive structure and a manufacturing method of a silicon micro-accelerometer, in particular to a sensitive structure and a manufacturing method of an electrostatic force rebalancing pendulum silicon micro-accelerometer. Background technique [0002] Silicon accelerometer is an important mechanical sensor widely used in control, navigation, monitoring and other systems. In 1977, Stanford University in the United States first manufactured an open-loop silicon accelerometer using micromachining technology, but the performance of this early-produced silicon accelerometer was relatively poor, specifically manifested in small dynamic range, low resolution, bias and The stability of the scale factor is relatively poor, which cannot meet the precision requirements of the inertial instrument. With the further development of semiconductor technology, especially the development of MEMS, the closed-loop force balance silicon accelero...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/125
Inventor 王巍何胜邢朝洋赵采凡王岩谢海龙朱红生孙洪强
Owner BEIJING AEROSPACE TIMES OPTICAL ELECTRONICS TECH
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