Cleaning jig of capillary for wire bonding, cleaning device of capillary for wire bonding, method for fabricating thereof and method for cleaning using the same
A wire bonding device and wire bonding technology, which are applied to cleaning methods and utensils, cleaning methods using tools, cleaning methods using gas flow, etc., can solve problems such as quality deterioration, and achieve the effect of prolonging service life and improving productivity
Inactive Publication Date: 2011-08-10
KOSMA
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- Abstract
- Description
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- Application Information
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Problems solved by technology
[0031] Must be performed by highly skilled personnel; this work must be performed by highly skilled specialists; during cleaning, the surface of the capillary tip may be abraded by the diamond film ; when the diamond film is in contact with the capillary tip portion, the foreign matter to be removed closes the capillary hole in which the lead wire 6 is inserted; and the foreign matter falls on the chip and the jig, which causes quality deterioration
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[0096] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0097] Meanwhile, widely used terms are selected in the specification, however, in a specific case, the applicant of the present invention can freely select the terms. In this case, the meanings of the corresponding terms will be described in detail in the detailed description of the present invention. We need to be clear: the present invention should be understood by the meaning of the terms, not by the names of the terms.
[0098] Also, in describing the embodiments, descriptions of technical contents that are well known to those skilled in the art and not directly related to the present invention will not be repeated. This will convey the invention more clearly without obscuring the subject matter of the invention with unnecessary detail.
[0099] Figure 5 is a perspective view for explaining a cleaning device for a capillary for w...
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Abstract
The present invention relates to a cleaning jig of a capillary for wire bonding, a cleaning device of a capillary for wire bonding, a method for fabricating thereof, and a method for cleaning a capillary using the same, which can remove pollutants in the capillary without separating the capillary from a transducer at the time of performing the wire bonding work using the capillary for wire bonding.
Description
technical field [0001] The present invention relates to a cleaning jig for a capillary for wire bonding, a cleaning device for a capillary for wire bonding, a manufacturing method thereof, and a method for cleaning a capillary using the same, when performing a wire bonding operation using the capillary for wire bonding, The fixture, device and method remove contaminants in the capillary without detaching the capillary from the sensor. Background technique [0002] Generally, a wire bonding process in a process for manufacturing a semiconductor device refers to connecting a bonding pad of a semiconductor die and a conductive pattern of a substrate to each other through a wire made of gold or the like. In other words, the pads on the semiconductor chip are connected to the wires of the lead frame by performing a wire bonding process. [0003] Wire bonding is accomplished with a wire bonder that includes a discharge tip that forms a sphere in the wire, a sensor body that conta...
Claims
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Login to View More IPC IPC(8): H01L21/60
CPCH01L2924/01082H01L2924/00014H01L24/85H01L2924/01038H01L2224/78308H01L2924/01029H01L24/78H01L2924/01105B23K20/26H01L2924/01027H01L2224/7801H01L2924/01013H01L2924/01056H01L2224/45147H01L2224/85H01L24/45H01L2224/78301B08B5/04H01L2924/01079B08B1/008H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/0106H01L2924/01074H01L2924/01078H01L2924/01042B23K20/005H01L2224/45144H01L2924/01015H01L2224/45015H01L2224/85205B08B1/30H01L2224/48H01L2924/00H01L2924/20752H01L2924/20753H01L21/00
Inventor 金基福金在鹏
Owner KOSMA