Light emitting diode package structure

Inactive Publication Date: 2005-01-20
LIN MING DER +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] In view of the above-mentioned problems, an object of the present invention is to provide a light emitting diode package structure capabl

Problems solved by technology

Moreover, during the mounting of the light emitting diode 10 over the package base 20 in the flip-chip way, it is necessary for the metal solder b

Method used

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  • Light emitting diode package structure
  • Light emitting diode package structure
  • Light emitting diode package structure

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Example

[0032] Referring to FIGS. 3(a) and 3(b), the second embodiment according to the present invention is different from the first embodiment according to the present invention in that a recess 41 of the second embodiment is formed with two stepwise portions. More specifically, a lower sidewall surface 43a, an intermediate mesa plane 44a, and an upper sidewall surface 45a make up one stepwise portion while a lower sidewall surface 43b, an intermediate mesa plane 44b, and an upper sidewall surface 45b make up another stepwise portion. Moreover, a planar metal layer 46a is formed on both of the intermediate mesa plane 44a and the upper sidewall surface 45a while a planar metal layer 46b is formed on both of the intermediate mesa plane 44b and the upper sidewall surface 45b. On the top surface of the transparent insulating carrier base 40, in a region other than the recess 41, two metal pads 47a and 47b are formed separately from each other. The metal pad 47a is connected with the planar me...

Example

[0036] Referring to FIG. 4, the third embodiment according to the present invention is different from the first embodiment according to the present invention in that an insulating carrier base 50 of the third embodiment is not necessarily transparent and a through hole 51 instead of a recess is formed in an approximately central region of the insulating carrier base 50. The through hole 51 penetrates the insulating carrier base 50 to form a lower opening 52a and an upper opening 52b. It should be noted that the present invention is not limited to the configuration shown in FIG. 4 and the aperture of the lower opening 52a may be larger than, equal to, or smaller than that of the upper opening 52b.

[0037] Under a condition that the lower opening 52a is temporarily sealed, a transparent resin 53a is injected through the upper opening 52b into the through hole 51 to partially fill the through hole 51. Subsequently, the light emitting diode 10 is delivered into the through hole 51 from t...

Example

[0040] Referring to FIG. 5, the fourth embodiment according to the present invention is different from the second embodiment according to the present invention in that an insulating carrier base 60 of the fourth embodiment is not necessarily transparent and a through hole 61 instead of a recess is formed in an approximately central region of the insulating carrier base 60. The through hole 61 penetrates the insulating carrier base 60 to form a lower opening 62a and an upper opening 62b. It should be noted that the present invention is not limited to the configuration shown in FIG. 5 and the aperture of the lower opening 62a may be larger than, equal to, or smaller than that of the upper opening 62b.

[0041] Like the recess 41 of the second embodiment, the through hole 61 is formed with two stepwise portions. With a manufacturing method similar to that in the third embodiment, the substrate 11 of the light emitting diode 10 is supported by the transparent resin 63a and then a transpar...

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Abstract

A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional application of prior U.S. application Ser. No. 10 / 379,234, filed Mar. 3, 2003, which is pending.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a light emitting diode package structure and, more particularly, to a package structure capable of enhancing the lighting efficiency of a light emitting diode and packaging a light emitting diode in a relatively simple process, thereby increasing the production yield and decreasing the production cost. [0004] 2. Description of the Related Art [0005] For commercial and industrial applications, light emitting diodes provide a light source at a higher efficiency and a lower cost than incandescent lamps and fluorescent lamps. In recent years, a variety of package structures and methods have been developed for the light emitting diodes, such as a surface mounting type package structure and a flip-chip type package s...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54H01L33/56
CPCH01L33/486H01L33/54H01L33/56H01L33/641H01L2224/14H01L2224/48091H01L2224/49107H01L2224/16225H01L2924/00014H01L24/05H01L2224/05568H01L2224/05573H01L2224/056H01L2224/06102
Inventor LIN, MING-DERHSU, JUNG-KUEILIN, SAN-BAO
Owner LIN MING DER
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