LED (light emitting diode) lighting module and method for manufacturing LED lighting module

Abstract

The invention relates to an LED (light emitting diode) lighting module, comprising a metal heat conduction plate, a circuit board, a hot joining layer and a plurality of LED crystal grains, wherein the metal heat conduction plate comprises a bearing surface with a plurality of bearing areas; the circuit board comprises a board body, a bottom surface circuit which is formed at the bottom surface of the board body, a top surface circuit which is formed at the top surface of the board body and a plurality of through holes which penetrate through the board body; the hot joining layer is provided with a lower surface which is connected with the bearing surface and an upper surface which is connected with the bottom surface circuit; and the LED crystal grains are respectively arranged in each through hole, respectively cling to each bearing area, and are electrically connected with the top surface circuit.

Description

technical field [0001] The invention relates to a light-emitting module, in particular to an LED light-emitting module with good heat dissipation. Background technique [0002] Light Emitting Diodes (LEDs) have the characteristics of energy saving, fast response, long life and small size, etc., and a plurality of LEDs are arranged on a circuit board and assembled into an LED module to replace traditional light sources. In recent years, with the improvement of the brightness and power of LEDs, the problem of heat dissipation of LED modules has quietly emerged. [0003] At present, only about 20% of LEDs are converted into light when they are in use, and the remaining 80% are converted into heat energy, so if the LED module cannot discharge the waste heat generated by the LED in a timely manner, it will lead to the problem of light decay and overheating. The application of the LED module will also be limited. Therefore, it is still necessary to further improve the heat dissip...

AI Technical Summary

Problems solved by technology

[0005] However, in this heat dissipation structure, the metal base 131 is added to conduct heat, so that the overall thickness increases, and the insulating package 133 in this structure will age and change color to cause light decay under long-term use. It will cause electrical connection problems and affect the life of the light emitting diode chip 132, so there is room for further improvement in the heat dissipation of the light emitting diode

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