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Method for demoulding chip

A chip and film release technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems that cannot meet mass production, large-scale application is not practical, and the risk factor of scratching chips can reduce the risk of being scratched. Possibility of injury, reduction of labor cost, low cost effect

Active Publication Date: 2013-11-06
CHANGZHOUSR SEA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the chip reaches the manufacturer at the processing end, it needs to separate the chip from the surface of the film. There are two commonly used methods: 1. Manually remove the chip from the film. On the one hand, this production method requires a lot of manpower and takes a lot of time. , can not meet the needs of mass production, another convenience in the process of dialing the chip, due to the uncertainty of human operation, the risk factor of scratching the chip is high; 2: people also found the defect of manual stripping, according to the actual situation The film stripping machine is specially designed. Considering the limitations of the mechanical device, the speed of the film stripping machine is set at a lower speed. The film stripping machine overcomes the defects of manual stripping, and its stripping speed has been improved, but still It cannot meet the production needs. In addition, the cost of the stripping machine is relatively high, and it is not practical to apply it on a large scale in actual production. Therefore, the unit designer designed a fast and low-cost stripping method based on the actual experience in production.

Method used

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Embodiment Construction

[0019] The present invention is further described below:

[0020] The method for chip stripping: it is characterized in that comprising the following steps:

[0021] a. Take a piece of film-coated chip and soak the non-film-coated side with water.

[0022] b. Paste the soaked chip on a clean glass sheet. One side of the chip is bonded with a film, and the other side is attached to the surface of the glass sheet. There is a water layer between the chip and the glass sheet.

[0023] c. Put the chip-attached glass sheet into the freezer for freezing, and the freezer freezes the water layer between the chip and the glass sheet to freeze it, even if the chip is fixed on the surface of the glass sheet.

[0024] d. After freezing for a certain period of time, the freezing time in the above step d is 25 to 35 minutes, and the temperature of the freezer is set at 0 to -5°C. The set temperature parameters and time parameters can ensure that the chip and the glass sheet The firmness of...

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PUM

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Abstract

The invention relates to a method for demoulding a glass passivation chip, belonging to the field of chip production methods. The method for demoulding the glass passivation chip is characterized by comprising the following steps of: a, taking a film adhering chip, and soaking one surface of the film coating chip, which is not adhered with a film, by using water; b, adhering the soaked chip to a clean glass sheet; c, placing the glass sheet adhered with the chip into a freezer for freezing; d, freezing for certain time, and then taking out the glass sheet from the freezer, and tearing the film by using a hand; e, placing the glass sheet with the chip into high-purity water, unfreezing and separating the chip and the glass sheet; and f, taking out the chip from a water tank, cleaning, and drying. The invention has the advantages of solving the problems of much demanded labor power and low efficiency of manual demoulding, also solving the problem of high cost of mechanical demoulding by adopting lower-cost equipment, additionally preventing the scratch of the surface of the chip during preorder processing, reducing the waste of the chip during the preorder processing and saving the cost.

Description

technical field [0001] The invention belongs to the field of chip production methods, in particular to a method for stripping a glass passivation chip. Background technique [0002] When packaging glass passivated chips, in order to facilitate subsequent transportation and handling, manufacturers generally bond the chips on the surface of a film, so that the chips are arranged in an orderly manner, which is convenient for statistics, and there is no possibility of sliding, which is convenient for storage and transportation and shipping shipments. After the chip reaches the manufacturer at the processing end, it needs to separate the chip from the surface of the film. There are two commonly used methods: 1. Manually remove the chip from the film. On the one hand, this production method requires a lot of manpower and takes a lot of time. , can not meet the needs of mass production, another convenience in the process of dialing the chip, due to the uncertainty of human operati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H05K13/02
Inventor 巢芸
Owner CHANGZHOUSR SEA ELECTRONICS
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