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Micro-channel water-cooling heat-sink device and packaging method thereof

A micro-channel and micro-channel technology, which is applied to laser parts, electrical components, lasers, etc., can solve the problems of being too simple and low heat transfer efficiency, so as to help heat dissipation, improve heat transfer efficiency, and improve heat dissipation efficiency Effect

Active Publication Date: 2013-09-25
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a micro-channel water-cooled heat sink device and its assembly method, which are used to solve the problems of the conventional heat sink in the prior art that the way of water flow is too simple and the heat exchange efficiency is low

Method used

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  • Micro-channel water-cooling heat-sink device and packaging method thereof
  • Micro-channel water-cooling heat-sink device and packaging method thereof
  • Micro-channel water-cooling heat-sink device and packaging method thereof

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Embodiment 1

[0030] Such as figure 1 Shown is a structural diagram of a micro-channel water-cooled heat sink device provided by the present invention, the device includes: an upper heat sink block 110 and a lower heat sink block 120, and the upper and lower heat sink blocks are attached to each other There is a groove on the surface side respectively. When the upper and lower heat sink blocks are bonded together, the upper and lower grooves in the middle part form a temperature-controlled element placement groove 130; A water-cooled temperature control structure 140 is arranged on the outer edge of the groove; and a tablet pressing platform 150 is respectively arranged at both ends of the water-cooling temperature control structure 140, and the tablet pressing platform 150 is used to place a sealing pressing tablet 160, and the sealing pressing tablet 160 seals the water-cooling temperature control interface 140; the upper and lower heat sink blocks are also arranged with water inlet and o...

Embodiment 2

[0040] Based on the micro-channel water-cooled heat sink device provided by the present invention, the present invention also provides an assembly method of the micro-channel water-cooled heat sink device, which specifically includes the following steps:

[0041] Step 1. Use an ultrasonic cleaning heat sink device to clean all components.

[0042] Step 2. Preparation before encapsulating the laser crystal: Put two drops of alcohol on both ends of the rod groove of the upper heat sink block, wipe it from one end to the other end with a cotton swab, and then repeat the wiping process with another cotton swab; The rod groove of the heat sink block is cleaned.

[0043] Step 3. Crystal packaging: Wrap the prepared rod-shaped crystal with thermal conductive foil, place it in the middle of the crystal rod groove of the lower heat sink block, and then press the upper heat sink block on the lower heat sink block; wherein, the thickness of the thermal conductive foil is more than , The...

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Abstract

The invention discloses a micro-channel water-cooling heat-sink device and a packaging method thereof. The device comprises an upper heat-sink block and a lower heat-sink block which are respectively provided with a water inlet and a water outlet, wherein the upper heat-sink block fits with the lower heat-sink block to form a controlled temperature component placing groove; a water-cooling temperature-control structures are respectively arranged at the periphery of the controlled temperature component placing groove on the upper heat-sink block and the lower heat-sink block; and sealing press sheets are arranged at two sides of each water-cooling temperature-control structure. The device is characterized in that the water-cooling temperature-control structures are of a water flow micro-channel structure formed by connecting a plurality of round-toothed micro-channels in series in an interlaced mode. The device is utilized to solve the problems that a general heat-sink water-running mode is too simple and has poor heat exchange efficiency; and the device is utilized to greatly improve the heat exchange efficiency of heat sink and water, thus increasing the radiating efficiency of the heat sink.

Description

technical field [0001] The invention relates to the field of mechanical technology, in particular to a micro-channel water-cooled heat sink device and an assembly method thereof. Background technique [0002] Generally, the diode-pumped solid-state laser system is a high-power, highly integrated system with many heating units, mainly including laser diode (LD), laser crystal, Q-switch crystal and driver, nonlinear crystal, etc. When the laser is running, each unit The heat dissipation power requirements, temperature control points and temperature control accuracy are not the same, especially in industrial and military applications, the operating temperature range of the laser system is very wide, generally from -40 ° C to +55 ° C range lasers must normal work. In order to ensure a constant working temperature range of each cooling unit, the functional requirements under high and low temperature conditions should be treated differently. Therefore, the heat dissipation capab...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S3/042
Inventor 王克强韩隆吴军勇魏磊胡学浩苑利钢郑毅耿圆圆钟国舜
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP