Liquid crystal substrate bonding system

Abstract

The invention discloses a liquid crystal substrate bonding system, which has a simple structure, shortens the producing time of liquid crystal panel and prevents generation dust generation. The liquid crystal substrate bonding system comprises a first conveying line (5) composed by a roller conveying mechanism for conveying lower substrates, a paste agent coating machine (7) coating sealant on the first conveying line (5), a short circuit electrode forming coating machine (8) disposed at the downstream side of the paste agent coating machine (7), a liquid crystal dropping device (9) which makes the liquid crystal material drop, and a first inspection chamber (10) serial connection device for inspecting the state of a lower substrate (1). A second conveying line (6) composed by a roller conveying mechanism for conveying an upper substrate (2) is disposed on the first conveying line (5) in parallel connection. The terminal part of the second conveying line is provided with a substrate counter-rotating device which conducts the substrate counter rotation in a fan-shaped manner for rotating the upper substrate. A third conveying line (20) composed by a roller conveying mechanism connected to the first conveying line (5) is disposed at a connection point of the first conveying line (5) and the second conveying line (6). A transmission chamber (12), a substrate bonding chamber (15), an ultraviolet ray irradiation chamber (17) and a panel inspection chamber (18) are disposed on the third conveying line (20) in serial connection.

Description

technical field [0001] The present invention relates to a substrate bonding system, and more particularly to a substrate bonding system which shortens the time until bonding is completed and minimizes the transfer of substrates by robots in the system. Background technique [0002] In the manufacture of liquid crystal display panels, there is a process in which liquid crystal is dropped on one substrate in advance, and the two glass substrates on which the transparent electrodes and thin-film transistor matrix are installed are placed very close to each other at a distance of several μm. The gap is bonded with an adhesive (hereinafter also referred to as a sealant) provided on the peripheral portion of the substrate (the bonded substrate will be referred to as a liquid crystal panel hereinafter), and the liquid crystal is enclosed in the space formed thereby. [0003] In the encapsulation of this liquid crystal, there is an adhesion method, etc., in which the liquid crystal ...

AI Technical Summary

Problems solved by technology

Therefore, if the substrate is reversed in this way before the panel is assembled (before bonding), the surrounding air will be disturbed, and the dust falling on the conveying line will fly up, and the dust will enter the liquid crystal panel and become an action. Causes of poor quality and reduced image quality

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